- Slave dual Industry Pack carrier, CPCI 3U format
- 3.3 or 5 volts PCI signaling
- Support for up to two IP modules
- 8 MHz or 32 MHz IP operation per slot, software programmable
- Direct I/O or memory-mapped access from CPCI bus via PLX 9056 PCI Chip
- Supports double-wide form factor Industry Pack
- Full interrupt support of host
- Front panel I/O connectors for all IP’s; rear connector I/O also available
- Up to 96 I/O’s on one single slot
CPCI-SIP66
CPCI Slave Dual Industry Pack Carrier, PLX
- Slave dual Industry Pack carrier, CPCI 3U format
- 3.3 or 5 volts PCI signaling
- Support for up to two IP modules
- 8 MHz or 32 MHz IP operation per slot, software programmable
- Direct I/O or memory-mapped access from CPCI bus via PLX 9056 PCI Chip
- Supports double-wide form factor Industry Pack
- Full interrupt support of host
- Front panel I/O connectors for all IP’s; rear connector I/O also available
- Up to 96 I/O’s on one single slot
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CPCI-SIP66
CPCI Slave Dual Industry Pack Carrier, PLX
The CPCI-SIP66 is a 3U format slave Compact PCI (CPCI) bus IP carrier. It provides mechanical support and the electrical interfaces for two single-width IP modules or one double-width IP module. Multiple CPCI-SIP66 boards can be installed in a single system.
Available Software Drivers:
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- LabView
- Linux
- Windows XP
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Applications:
For applications requiring low-cost, high-density I/O or unique I/O combinations, the CPCI-SIP66 is the perfect solution.
Industry Pack Specifications:
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- Meets ANSI/VITA 4-1995
- 8/32 MHz synchronous operation
- Supports ID, 128-byte I/O, interrupt & 8 Mbyte memory spaces
- 2 interrupts per module
- Two passive DMA channels are possible
- Hardware self-timed per IP module
- Triggered via system reset and software control
- Jumper or software time-out function
- 5, +/-12 volt reset-able fuse per IP
- 8/16-bit data on 3U board, 32-bit on 6U board
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Operating Environment:
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- Operating temperature:
- Commercial: 0 to +70 ºC
- Optional: -40 ºC to +85 ºC
- Non-operating: -55 ºC to +100 ºC
- Airflow requirement – 5 CFM
- Humidity – 5 to 90% (non-condensing)
- Altitude – 0 to 10,000 feet
- Operating temperature:
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Mechanical Environment:
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- Size – 3U CPCI module (100mm x 160mm)
- Power – 1 watt
- Vibration – 0.5G, 20-2000 Hz random
- Shock – 20G, 11 msec, ½ sine
- Weight – 5 ounces
- MTBF – >250,000 hours
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PCI Bus Controller Features:
PCI Bus Control:
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- PLX 9056 33/66MHz 32-bit, PCI r2.2 compliant
- Motorola PowerQUICC and generic 32-bit, 66MHz local bus modes
- 3.3V I/O, 5V tolerant bus interfaces
- PICMG 2.1 r2.0
- Zero wait state burst operation, with PCI bus bursts to 264 MB/sec and local bus bursts to 264 MB/sec
- 2 DMA channels
- Direct master data transfers
- Direct slave data transfers
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PCI Bus Control:
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- I2O r1.5 messaging unit
- 8 mailboxes and 32 doorbell registers
- PCI arbiter supports 7 external masters
- Host mode reset/interrupt
- Power management event generation support
- Serial EEPROM interface
CPCI-SIP66
3U CPCI Slave Industry Pack Carrier with Front I/O only
CPCI-SIP66-I
Same as above but Industrial temp: -40 oC to +85 oC
Optional Accessories:
CBL-50-HDR
Cable
TB-50-HDR
Terminal block
- Slave dual Industry Pack carrier, CPCI 3U format
- 3.3 or 5 volts PCI signaling
- Support for up to two IP modules
- 8 MHz or 32 MHz IP operation per slot, software programmable
- Direct I/O or memory-mapped access from CPCI bus via PLX 9056 PCI Chip
- Supports double-wide form factor Industry Pack
- Full interrupt support of host
- Front panel I/O connectors for all IP’s; rear connector I/O also available
- Up to 96 I/O’s on one single slot
| Mechanical Interface | Switched Mezzanine Card (XMC) Interface confirming to ANSI/VITA 42.0-2008 (Auxiliary Standard) Standard single-width (149mm x 74mm) | |||||||||
| Electrical Interface | PCI Express x4 Link (Base Specification 2.1) compliant interface conforming to ANSI/VITA 42.3-2006 (PCI Express Protocol Layer Standard) | |||||||||
| PCI Express Switch | PI7C9X2G312GP (Pericom) | |||||||||
| PCI Express to PCI Bridge | XIO2001 (Texas Instruments) | |||||||||
| User configurable FPGA | TXMC639-10R: XC7K160T-2FBG676I (AMD) TXMC639-11R: XC7K325T-2FBG676I (AMD) | |||||||||
| SPI-Flash | MT25QL128 (Micron) 128 Mbit (contains TXMC639 FPGA BRD) or compatible; +3.3 V supply voltage | |||||||||
| DDR3 RAM | 2x MT41K256M16TW-107 (Micron) 256Meg x 32 bit | |||||||||
| Board Configuration Controller | LCMXO2-7000HC (Lattice) | |||||||||
| ADC | LTC2320 -16 (Analog Devices) | |||||||||
| DAC | AD5547BRUZ (Analog Devices) | |||||||||
| A/D Channels | TXMC639-10R: 8 Differential 16bit A/D Channels TXMC639-11R: 16 Differential 16bit A/D Channels Input Configuration per BCC Device: Input Voltage Ranges: Differental : ±20.57 V, ±10.28 V or ±5.14 V (Single-Ended: ±10.28 V, ±5.14 V or ±2.57 V) All analog inputs are connected via an impedance converter and a second operation amplifier for level adjustment and filtering to the differential ADC inputs. The -3 dB limit of this input stage is at approx. 8MHz | |||||||||
| D/A Channels | TXMC639-10R: 4 Single-Ended 16 Bit D/A Channels TXMC639-11R: 8 Single-Ended 16 Bit D/A Channels Output range configurable per D/A channel. Maximum single-ended Output Voltage – Vout: ±10 V Maximum Output Drive Current for each Output: 10 mA Maximum Capacitive Load for each Output: 1000 pF Typical Settling Time for a 10 mA / 1000 pF: < 1 µs | |||||||||
| Digital Front I/O Channels | 32 digital I/O Lines
| |||||||||
| Digital Rear I/O Channels | 64 direct FPGA I/O lines to P14 Rear I/O connector
4 MGT line to P16 Rear I/O connector
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| Front I/O | Front I/O Samtec – ERF8_050_01_L_D_RA_L_TR | |||||||||
| P14 Rear I/O | 64 pin Mezzanine Connector (Molex 71436-2864 or compatible) | |||||||||
| P16 Rear I/O | 114 pin Mezzanine Connector (Samtec – ASP-105885-01) | |||||||||
| Power Requirements 1) | Depends on FPGA design With TXMC639 Board Reference Design / without external load
| |||||||||
| Temperature Range | Operating: – 40 °C to + 85 °C Storage: – 55 °C to + 125 °C | |||||||||
| MTBF 1) | 157 000 h to 161 000 h | |||||||||
| Humidity | 5% – 95% non-condensing | |||||||||
| Weight | 140 g |
1) depends on variant, for further details see User Manual
TXMC639-10R
| 8x Analog In, 4x Analog Out, XC7K160T-2FBG676 Kintex™ 7 FPGA AMD Kintex™ 7 FPGA (XC7K160T-2FBG676), 1GB DDR3, 8x Analog In, 4x Analog Out, 32x digital Front I/O, 64x direct FPGA Rear I/O Lines and 4x MGTs Rear I/O |
TXMC639-11R
| 16x Analog In, 8x Analog Out, XC7K325T-2FBG676 Kintex™ 7 FPGA AMD Kintex™ 7 FPGA (XC7K325T-2FBG676), 1GB DDR3, 16x Analog In, 8x Analog Out, 32x digital Front I/O, 64x direct FPGA Rear I/O Lines and 4x MGTs Rear I/O |
SOFTWARE
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