- Form Factor: Single wide XMC Module (2.92” x 5.87”)
- FPDP Standard: ANSI/VITA 17-1997 Front Panel Data Port standard.
- I/O Interface Options: TTL, RS-422 and Custom Mezzanine Options
- Parallel I/O: 32 Bits Parallel I/O
- FIFO: 128 KBytes deep Fifo per Module (TX / RX)
- Data Transfer: Data Transfer by On-Board DMA or PCIe Master
- Interrupts: PCIe Interrupt on Fifo Level
- Clock: Programable Clock & Selectable Internal / external CLK
- Options: VITA 42 compliant, 1 Lane PCie express, Conformal coating
XMC-FPD-XXX
FPDP DIGITAL PARALLEL I/O XMC BOARD
- Form Factor: Single wide XMC Module (2.92” x 5.87”)
- FPDP Standard: ANSI/VITA 17-1997 Front Panel Data Port standard.
- I/O Interface Options: TTL, RS-422 and Custom Mezzanine Options
- Parallel I/O: 32 Bits Parallel I/O
- FIFO: 128 KBytes deep Fifo per Module (TX / RX)
- Data Transfer: Data Transfer by On-Board DMA or PCIe Master
- Interrupts: PCIe Interrupt on Fifo Level
- Clock: Programable Clock & Selectable Internal / external CLK
- Options: VITA 42 compliant, 1 Lane PCie express, Conformal coating
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XMC-FPD-XXX
FPDP DIGITAL PARALLEL I/O XMC BOARD
The specifications include compliance with the ANSI/VITA 17-1997 Front Panel Data Port standard, supporting both TTL and RS-422 interfaces. The module is VITA 42 compliant, featuring a 1 Lane PCIe Express interface. Additional options include conformal coating for enhanced durability. It includes a 128 Kbyte Deep FIFO and supports DMA for efficient data transfer. The module also features All Bytes Swap capability and a programmable clock with selectable internal/external clock options. It supports data rates up to 160Mb/s and includes advanced synchronization control.
Programmable via:
- XMC Bus VITA 42
- 3.3V I/O, 5V tolerant bus interfaces
- Local Bus Clock rates at 66MHz
- Compliant PCIe Specification, r1.0a x1
- Direct slave data transfers
- DMA Capability
- Up to 160Mb/s Transfer
- DMA Transfer per FIFO Level
Features Front-End Processing:
- ANSI/VITA 17-1997 Front Panel Data Port standard
- Flexible Packing options: 1×32, 2×16, or 3×10 bits
- Advanced Synchronization control features
- Programmable Clock Generator
- Mezzanine Options Interface: TTL, RS-422, and Custom
- 32 Bits Parallel I/O
Features FIFO:
- 128 KBytes deep FIFO per Module (TX/RX)
- Data Transfer by On-Board DMA or PCIe Master
- PCIe Interrupt on FIFO Level
Operating Environmental:
- Operating temperature: Industrial -40°C to +85°C
- Airflow requirement: 0.5 CFM
- Humidity: 5 to 90% (non-cond.)
- Altitude: 0 to 20,000 ft
Non-Operating:
- Non-Operating temperature: -55°C to +105°C
Mechanical Environmental:
- Size: Single wide XMC, 2.92” x 5.87”
- Power: 1.5 watt
- Front panel I/O
- Vibration: 0.5G RMS, 20-2000 Hz random
- Shock: 20G, 11 ms, ½ sine
- Weight: TBD
- MTBF: >250,000 hours
Ordering Information
- Part Number: XMC-FPDP-FIU-128-I – XMC FPDP, TTL Input Module, 128K Receive Fifo, Industrial
- Part Number: XMC-FPDP-FOU-128-I – XMC FPDP, TTL Output Module, 128K Transmit Fifo, Industrial
- Part Number: XMC-FPDP-DIU-128-I – XMC FPDP, RS-422 Input Module, 128K Receive Fifo, Industrial
- Part Number: XMC-FPDP-DOU-128-I – XMC FPDP, RS-422 Output Module, 128K Transmit Fifo, Industrial
- -cc – Acrylic Conformal Coat (optional)
- Form Factor: Single wide XMC Module (2.92” x 5.87”)
- FPDP Standard: ANSI/VITA 17-1997 Front Panel Data Port standard.
- I/O Interface Options: TTL, RS-422 and Custom Mezzanine Options
- Parallel I/O: 32 Bits Parallel I/O
- FIFO: 128 KBytes deep Fifo per Module (TX / RX)
- Data Transfer: Data Transfer by On-Board DMA or PCIe Master
- Interrupts: PCIe Interrupt on Fifo Level
- Clock: Programable Clock & Selectable Internal / external CLK
- Options: VITA 42 compliant, 1 Lane PCie express, Conformal coating
| Mechanical Interface | Switched Mezzanine Card (XMC) Interface confirming to ANSI/VITA 42.0-2008 (Auxiliary Standard) Standard single-width (149mm x 74mm) | |||||||||
| Electrical Interface | PCI Express x4 Link (Base Specification 2.1) compliant interface conforming to ANSI/VITA 42.3-2006 (PCI Express Protocol Layer Standard) | |||||||||
| PCI Express Switch | PI7C9X2G312GP (Pericom) | |||||||||
| PCI Express to PCI Bridge | XIO2001 (Texas Instruments) | |||||||||
| User configurable FPGA | TXMC639-10R: XC7K160T-2FBG676I (AMD) TXMC639-11R: XC7K325T-2FBG676I (AMD) | |||||||||
| SPI-Flash | MT25QL128 (Micron) 128 Mbit (contains TXMC639 FPGA BRD) or compatible; +3.3 V supply voltage | |||||||||
| DDR3 RAM | 2x MT41K256M16TW-107 (Micron) 256Meg x 32 bit | |||||||||
| Board Configuration Controller | LCMXO2-7000HC (Lattice) | |||||||||
| ADC | LTC2320 -16 (Analog Devices) | |||||||||
| DAC | AD5547BRUZ (Analog Devices) | |||||||||
| A/D Channels | TXMC639-10R: 8 Differential 16bit A/D Channels TXMC639-11R: 16 Differential 16bit A/D Channels Input Configuration per BCC Device: Input Voltage Ranges: Differental : ±20.57 V, ±10.28 V or ±5.14 V (Single-Ended: ±10.28 V, ±5.14 V or ±2.57 V) All analog inputs are connected via an impedance converter and a second operation amplifier for level adjustment and filtering to the differential ADC inputs. The -3 dB limit of this input stage is at approx. 8MHz | |||||||||
| D/A Channels | TXMC639-10R: 4 Single-Ended 16 Bit D/A Channels TXMC639-11R: 8 Single-Ended 16 Bit D/A Channels Output range configurable per D/A channel. Maximum single-ended Output Voltage – Vout: ±10 V Maximum Output Drive Current for each Output: 10 mA Maximum Capacitive Load for each Output: 1000 pF Typical Settling Time for a 10 mA / 1000 pF: < 1 µs | |||||||||
| Digital Front I/O Channels | 32 digital I/O Lines
| |||||||||
| Digital Rear I/O Channels | 64 direct FPGA I/O lines to P14 Rear I/O connector
4 MGT line to P16 Rear I/O connector
| |||||||||
| Front I/O | Front I/O Samtec – ERF8_050_01_L_D_RA_L_TR | |||||||||
| P14 Rear I/O | 64 pin Mezzanine Connector (Molex 71436-2864 or compatible) | |||||||||
| P16 Rear I/O | 114 pin Mezzanine Connector (Samtec – ASP-105885-01) | |||||||||
| Power Requirements 1) | Depends on FPGA design With TXMC639 Board Reference Design / without external load
| |||||||||
| Temperature Range | Operating: – 40 °C to + 85 °C Storage: – 55 °C to + 125 °C | |||||||||
| MTBF 1) | 157 000 h to 161 000 h | |||||||||
| Humidity | 5% – 95% non-condensing | |||||||||
| Weight | 140 g |
1) depends on variant, for further details see User Manual
TXMC639-10R
| 8x Analog In, 4x Analog Out, XC7K160T-2FBG676 Kintex™ 7 FPGA AMD Kintex™ 7 FPGA (XC7K160T-2FBG676), 1GB DDR3, 8x Analog In, 4x Analog Out, 32x digital Front I/O, 64x direct FPGA Rear I/O Lines and 4x MGTs Rear I/O |
TXMC639-11R
| 16x Analog In, 8x Analog Out, XC7K325T-2FBG676 Kintex™ 7 FPGA AMD Kintex™ 7 FPGA (XC7K325T-2FBG676), 1GB DDR3, 16x Analog In, 8x Analog Out, 32x digital Front I/O, 64x direct FPGA Rear I/O Lines and 4x MGTs Rear I/O |
SOFTWARE
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