XMC-MFIO-8

XMC Multi Function I/O board 8 Channels A/D 16 Bits 15Msps 8 Channels D/A 16 Bits 1µs +/-10V 16 Channel TTL Digital IO

  • Form Factor: Single Wide XMC Module (74mm x 149mm)
  • A/D Conversion: 8 Channels 16-bit, Simultaneously Sampled, 15 Msps
  • D/A Conversion: 8 Channels 16-bit, 1µs settling time
  • Digital I/O: 16 Channel TTL Digital IO (8 Input, 8 Output)
  • 8 Channels, True Differential
  • Instrumentation Amplifier per channel
  • 8.192VP-P Differential Inputs
  • Independent programable DDC per Channel (Decimation: 2 to 256)

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XMC-MFIO-8

XMC Multi Function I/O board 8 Channels A/D 16 Bits 15Msps 8 Channels D/A 16 Bits 1µs +/-10V 16 Channel TTL Digital IO

  • Form Factor: Single Wide XMC Module (74mm x 149mm)
  • A/D Conversion: 8 Channels 16-bit, Simultaneously Sampled, 15 Msps
  • D/A Conversion: 8 Channels 16-bit, 1µs settling time
  • Digital I/O: 16 Channel TTL Digital IO (8 Input, 8 Output)
  • 8 Channels, True Differential
  • Instrumentation Amplifier per channel
  • 8.192VP-P Differential Inputs
  • Independent programable DDC per Channel (Decimation: 2 to 256)

The XMC-MFIO-8 Simultaneously sampled A/D offers a mix of up to 8 Differential analog input channels at 8.192VP-P Fully Differential. All channel features handle analog input with a differential configuration for a rate up to 15Msps. The acquisition can be started by the host or by an on-board sequencer that uses a channel list to specify which channel to acquire. Each Channel has its own DDC that can be programmed independently for a decimation range from 2 to 256 programable in steps of 1. A DMA engine is used to transfer the acquisition data to the host. The board has 8 Channels of 16-bit, 1µs multiplying voltage Output. These DACs can be software-programmed for either 0 V to –10 V, 0 V to +10 V, or ±10 V outputs. The board also supports 8 TTL Digital Inputs with programmable selection for Pull up or Pull Down resistor. Each input has a programmable Interrupt selection, allowing each line to be programmed to throw an interrupt at both positive and negative edges. The board also supports 8 TTL Digital outputs with up to -32/-48mA of drive.

ADC Specifications:

  • 16-bit, SAR analog-to-digital converter (ADC)
  • 15Msps Throughput Rate
  • 93.8dB SNR (Typ) at fIN = 1MHz
  • 102dB SFDR (Typ) at fIN = 1MHz
  • Nyquist Sampling Up to 7.5MHz Input
  • Guaranteed 16-Bit, No Missing Codes
  • ±0.8LSB INL (Max)
  • 8.192VP-P Differential Inputs

DAC Specifications:

  • 16-bit, 4-quadrant, 6.8 MHz BW multiplying DAC
  • ±1 LSB DNL
  • ±1 LSB INL
  • Low noise: 12 nV/√Hz
  • 1µs Settling Full Scale
  • Buffered output +/-30ma

DIGITAL Input Specifications:

  • TTL Input
  • Programmable Pull up or Pull down
  • Interrupt support per Line
  • Falling/Rising Edge Selection

DIGITAL Output Specifications:

  • TTL Output
  • Outputs Source/Sink -32mA/+64mA

Multi-Board Synchronization:

  • Multiple board synchronization via software control for clocks and triggers
  • External trigger / Internal trigger

XMC Bus:

  • XMC Bus Interface x 4 PCIe Lane

I/O panel connectors:

  • Front Panel SMA Connectors Clock/Trigger
  • Front Panel 50 Pins SCSI Connector

Operating Environment:

  • Operating temperature: Commercial: 0 to +70 ºC, Optional: -40 ºC to +85 ºC
  • Non-operating: -45 ºC to +100 ºC
  • Airflow requirement – 5 CFM
  • Humidity – 5 to 90% (non-cond)
  • Altitude – 0 to 10,000 feet

Mechanical Environment:

  • Size – Single Wide XMC module: 74mm x 149mm
  • Power – 1.5 watt
  • Vibration – 0.5G, 20-2000 Hz rand
  • Shock – 20G, 11 msec, ½ sine
  • Weight – 3 ounces
  • MTBF – >250,000 hours

Available Drivers:

  • Labview
  • Linux
  • Window XP
  • VxWorks drivers

Applications:

  • Digital servo controls
  • Adaptive control
  • Military SONAR-RADAR
  • Vibration control systems
  • Other high-speed acquisition & controls system
  • XMC-MFIO-8: 8 Channels Of A/D 15Msps, D/A 1Msps and DIO, 0+70˚C
  • XMC-MFIO-8-I: 8 Channels Of A/D 15Msps, D/A 1Msps and DIO,-40+85˚C
  • XMC-16AD16-200: 16 Channels 16 Bits, 200KSP (Commercial Temp)
  • XMC-32AD16-200: 32 Channels 16 Bits, 200KSP (Commercial Temp)
  • XMC-16AD16-200-I: 16 Channels 16 Bits, 200KSP (Ext Temp)
  • XMC-32AD16-200-I: 32 Channels 16 Bits, 200KSP (Ext Temp)

Data Sheet – Link Here

User Manual – Link Here

  • Form Factor: Single Wide XMC Module (74mm x 149mm)
  • A/D Conversion: 8 Channels 16-bit, Simultaneously Sampled, 15 Msps
  • D/A Conversion: 8 Channels 16-bit, 1µs settling time
  • Digital I/O: 16 Channel TTL Digital IO (8 Input, 8 Output)
  • 8 Channels, True Differential
  • Instrumentation Amplifier per channel
  • 8.192VP-P Differential Inputs
  • Independent programable DDC per Channel (Decimation: 2 to 256)

 

Mechanical Interface

Switched Mezzanine Card (XMC) Interface confirming to ANSI/VITA 42.0-2008 (Auxiliary Standard)

Standard single-width (149mm x 74mm)

Electrical InterfacePCI Express x4 Link (Base Specification 2.1) compliant interface conforming to ANSI/VITA 42.3-2006 (PCI Express Protocol Layer Standard)
PCI Express SwitchPI7C9X2G312GP (Pericom)
PCI Express to PCI BridgeXIO2001 (Texas Instruments)
User configurable FPGA

TXMC639-10R: XC7K160T-2FBG676I (AMD)

TXMC639-11R: XC7K325T-2FBG676I (AMD)

SPI-FlashMT25QL128 (Micron) 128 Mbit (contains TXMC639 FPGA BRD) or compatible; +3.3 V supply voltage
DDR3 RAM2x MT41K256M16TW-107 (Micron) 256Meg x 32 bit
Board Configuration ControllerLCMXO2-7000HC (Lattice)
ADCLTC2320 -16 (Analog Devices)
DACAD5547BRUZ (Analog Devices)
A/D Channels

TXMC639-10R: 8 Differential 16bit A/D Channels

TXMC639-11R: 16 Differential 16bit A/D Channels

Input Configuration per BCC Device:

Input Voltage Ranges:

Differental : ±20.57 V, ±10.28 V or ±5.14 V

(Single-Ended: ±10.28 V, ±5.14 V or ±2.57 V)

All analog inputs are connected via an impedance converter and a second operation amplifier for level adjustment and filtering to the differential ADC inputs.

The -3 dB limit of this input stage is at approx. 8MHz

D/A Channels

TXMC639-10R: 4 Single-Ended 16 Bit D/A Channels

TXMC639-11R: 8 Single-Ended 16 Bit D/A Channels

Output range configurable per D/A channel.
Simultaneous Conversion for all D/A Channels.

Maximum single-ended Output Voltage – Vout: ±10 V

Maximum Output Drive Current for each Output: 10 mA

Maximum Capacitive Load for each Output: 1000 pF

Typical Settling Time for a 10 mA / 1000 pF: < 1 µs

Digital Front I/O Channels

32 digital I/O Lines

  • Default configured as 32 ESD-protected TTL lines
  • 16 I/O lines are configurable as 8 differential RS422 I/O lines with individual Termination enable.
Digital Rear I/O Channels

64 direct FPGA I/O lines to P14 Rear I/O connector

  • Can be used as single-ended or differential I/O
  • FPGA I/O Standard: LVCMOS25, LVTTL25 and LVDS25

4 MGT line to P16 Rear I/O connector

  • Each line consists of one differential RX and TX pair.
  • Transmission speeds of up to 3.125 Gb/s are possible.
Front I/OFront I/O Samtec – ERF8_050_01_L_D_RA_L_TR
P14 Rear I/O64 pin Mezzanine Connector (Molex 71436-2864 or compatible)
P16 Rear I/O114 pin Mezzanine Connector (Samtec – ASP-105885-01)
Power Requirements 1)

Depends on FPGA design

With TXMC639 Board Reference Design / without external load

 typical @ +12 V VPWRtypical @ +5 V VPWR
TXMC639-10R1.1 A2.5 A
TXMC639-11R1.3 A3.3 A
Temperature RangeOperating: – 40 °C to + 85 °C
Storage: – 55 °C to + 125 °C
MTBF 1)157 000 h to 161 000 h
Humidity5% – 95% non-condensing
Weight140 g

1) depends on variant, for further details see User Manual

 

TXMC639-10R

 

8x Analog In, 4x Analog Out, XC7K160T-2FBG676 Kintex™ 7 FPGA

AMD Kintex™ 7 FPGA (XC7K160T-2FBG676), 1GB DDR3, 8x Analog In, 4x Analog Out, 32x digital Front I/O, 64x direct FPGA Rear I/O Lines and 4x MGTs Rear I/O

TXMC639-11R

 

16x Analog In, 8x Analog Out, XC7K325T-2FBG676 Kintex™ 7 FPGA

AMD Kintex™ 7 FPGA (XC7K325T-2FBG676), 1GB DDR3, 16x Analog In, 8x Analog Out, 32x digital Front I/O, 64x direct FPGA Rear I/O Lines and 4x MGTs Rear I/O

SOFTWARE

Device Driver for Board Family with Reconfigurable FPGA

Data Sheet – Link-Here

User Manual – Link-Here

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