M.2-XCAU7P-FPGA

M.2 PCIe x4 USER RECONFIGURABLE AMD-XILINX ARTIX ULTRASCALE+ FPGA 16 Channels RS-422/485 OR 32 Channels LVTTL

Process Control

  • Industrial Control
  • Precision Instrumentation
  • Data Acquisition Systems (DAS)
  • Multiaxis Positioning Systems

Digital I/O Specifications:

  • RS-422/485 Channels: Up to 16 pairs
  • LVTTL Channels: Up to 32
  • Data Rate: 20 Mb/s per RS-422/485 channel
  • Input Impedance: High, supports up to 256 nodes
  • ESD Protection: Enhanced to ±25kV

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M.2-XCAU7P-FPGA

M.2 PCIe x4 USER RECONFIGURABLE AMD-XILINX ARTIX ULTRASCALE+ FPGA 16 Channels RS-422/485 OR 32 Channels LVTTL

Process Control

  • Industrial Control
  • Precision Instrumentation
  • Data Acquisition Systems (DAS)
  • Multiaxis Positioning Systems

Digital I/O Specifications:

  • RS-422/485 Channels: Up to 16 pairs
  • LVTTL Channels: Up to 32
  • Data Rate: 20 Mb/s per RS-422/485 channel
  • Input Impedance: High, supports up to 256 nodes
  • ESD Protection: Enhanced to ±25kV

The M.2-XCAU7P-FPGA module features 32 I/O channels, capable of monitoring or controlling the on/off status of up to 16 differential devices or up to 32 channels of LVTTL, with software selection in groups of 2. Each channel can function as either an input or output. Input channels can be configured with interrupts to detect state changes or level detection of any bit. The RS-422/485 input threshold includes hysteresis, enhancing noise immunity. This module provides flexibility in handling both differential and single-ended signals, making it suitable for various applications requiring precise control and monitoring.

Applications

  • Process control
  • Industrial control
  • Precision instrumentation
  • Data acquisition systems (DAS)
  • Multiaxis positioning systems

Digital I/O Specifications

  • Up to 16 channel pairs RS-422/485 or up to 32 channels LVTTL
  • 20 Mb/s data rate per RS422/485 channel
  • Optional 1-channel ARINC-429 RX driver
  • Optional high-precision PPB user clock
  • Half or full duplex and 120Ω onboard termination, software-selectable
  • High input impedance supports up to 256 nodes
  • Enhanced ESD protection to ±25kV

Available Software Drivers

  • C library DLLs
  • Linux drivers
  • Windows drivers
  • VxWorks drivers

M.2-XCAU7P-FPGA Mechanical Specifications

  • Size: M.2 module, 22mm x 80mm
  • Power consumption: To be determined
  • Front panel I/O options
  • Vibration resistance: 0.5G, 20-2000 Hz random
  • Shock resistance: 20G, 11 ms, ½ sine
  • Weight: To be determined
  • MTBF: >250,000 hours

Operating Environment

  • Operating temperature:
    • Industrial: -40°C to +85°C
  • Airflow requirement: 5 CFM
  • Humidity: 5 to 90% (non-condensing)
  • Altitude: Up to 10,000 feet

Part Number: M.2-XCAU7P-FPGA

    • 16 Channels differential RS-422/485 or 32 LVTTL, Industrial Temp: -40°C to +85°C

Part Number: M.2-XCAU7P-FPGA-1

    • 16 Channels differential RS-422/485 or 32 LVTTL, 1 Ch RX ARINC-429, High Precision 50 MHz Clock Input, Industrial Temp: -40°C to +85°C

Data Sheet – Link Here

User Manual – Link Here

Process Control
  • Industrial Control
  • Precision Instrumentation
  • Data Acquisition Systems (DAS)
  • Multiaxis Positioning Systems
Digital I/O Specifications:
  • RS-422/485 Channels: Up to 16 pairs
  • LVTTL Channels: Up to 32
  • Data Rate: 20 Mb/s per RS-422/485 channel
  • Input Impedance: High, supports up to 256 nodes
  • ESD Protection: Enhanced to ±25kV

 

Mechanical Interface

Switched Mezzanine Card (XMC) Interface confirming to ANSI/VITA 42.0-2008 (Auxiliary Standard)

Standard single-width (149mm x 74mm)

Electrical InterfacePCI Express x4 Link (Base Specification 2.1) compliant interface conforming to ANSI/VITA 42.3-2006 (PCI Express Protocol Layer Standard)
PCI Express SwitchPI7C9X2G312GP (Pericom)
PCI Express to PCI BridgeXIO2001 (Texas Instruments)
User configurable FPGA

TXMC639-10R: XC7K160T-2FBG676I (AMD)

TXMC639-11R: XC7K325T-2FBG676I (AMD)

SPI-FlashMT25QL128 (Micron) 128 Mbit (contains TXMC639 FPGA BRD) or compatible; +3.3 V supply voltage
DDR3 RAM2x MT41K256M16TW-107 (Micron) 256Meg x 32 bit
Board Configuration ControllerLCMXO2-7000HC (Lattice)
ADCLTC2320 -16 (Analog Devices)
DACAD5547BRUZ (Analog Devices)
A/D Channels

TXMC639-10R: 8 Differential 16bit A/D Channels

TXMC639-11R: 16 Differential 16bit A/D Channels

Input Configuration per BCC Device:

Input Voltage Ranges:

Differental : ±20.57 V, ±10.28 V or ±5.14 V

(Single-Ended: ±10.28 V, ±5.14 V or ±2.57 V)

All analog inputs are connected via an impedance converter and a second operation amplifier for level adjustment and filtering to the differential ADC inputs.

The -3 dB limit of this input stage is at approx. 8MHz

D/A Channels

TXMC639-10R: 4 Single-Ended 16 Bit D/A Channels

TXMC639-11R: 8 Single-Ended 16 Bit D/A Channels

Output range configurable per D/A channel.
Simultaneous Conversion for all D/A Channels.

Maximum single-ended Output Voltage – Vout: ±10 V

Maximum Output Drive Current for each Output: 10 mA

Maximum Capacitive Load for each Output: 1000 pF

Typical Settling Time for a 10 mA / 1000 pF: < 1 µs

Digital Front I/O Channels

32 digital I/O Lines

  • Default configured as 32 ESD-protected TTL lines
  • 16 I/O lines are configurable as 8 differential RS422 I/O lines with individual Termination enable.
Digital Rear I/O Channels

64 direct FPGA I/O lines to P14 Rear I/O connector

  • Can be used as single-ended or differential I/O
  • FPGA I/O Standard: LVCMOS25, LVTTL25 and LVDS25

4 MGT line to P16 Rear I/O connector

  • Each line consists of one differential RX and TX pair.
  • Transmission speeds of up to 3.125 Gb/s are possible.
Front I/OFront I/O Samtec – ERF8_050_01_L_D_RA_L_TR
P14 Rear I/O64 pin Mezzanine Connector (Molex 71436-2864 or compatible)
P16 Rear I/O114 pin Mezzanine Connector (Samtec – ASP-105885-01)
Power Requirements 1)

Depends on FPGA design

With TXMC639 Board Reference Design / without external load

 typical @ +12 V VPWRtypical @ +5 V VPWR
TXMC639-10R1.1 A2.5 A
TXMC639-11R1.3 A3.3 A
Temperature RangeOperating: – 40 °C to + 85 °C
Storage: – 55 °C to + 125 °C
MTBF 1)157 000 h to 161 000 h
Humidity5% – 95% non-condensing
Weight140 g

1) depends on variant, for further details see User Manual

 

TXMC639-10R

 

8x Analog In, 4x Analog Out, XC7K160T-2FBG676 Kintex™ 7 FPGA

AMD Kintex™ 7 FPGA (XC7K160T-2FBG676), 1GB DDR3, 8x Analog In, 4x Analog Out, 32x digital Front I/O, 64x direct FPGA Rear I/O Lines and 4x MGTs Rear I/O

TXMC639-11R

 

16x Analog In, 8x Analog Out, XC7K325T-2FBG676 Kintex™ 7 FPGA

AMD Kintex™ 7 FPGA (XC7K325T-2FBG676), 1GB DDR3, 16x Analog In, 8x Analog Out, 32x digital Front I/O, 64x direct FPGA Rear I/O Lines and 4x MGTs Rear I/O

SOFTWARE

Device Driver for Board Family with Reconfigurable FPGA

Data Sheet – Link-Here

User Manual – Link-Here

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