- DSP: Based on the Texas Instruments floating-point Digital Signal Processor TMS320C6713B at 300 MHz
- Serial Controllers: Quad 16 MHz SCC85230 serial controllers with 8 serial channels total
- I/O Options: Optional mezzanine-based I/O or RS232C/RS422/RS485 drivers
- PCI Express Interface: PCIe x1 lane, compliant with PCIe Specification r1.0a, offering up to 250 MB/s bandwidth39
- Front Panel I/O: Front panel serial I/O available
- Communication Protocols: Multi-protocol support including synchronous, asynchronous, Bisync, Xon/Xoff, HDLC, or SDLC communication protocols
- Performance: Adds high-speed, low latency I/O and deterministic control to a low-cost PC system solution
PCIe-6713-ISC8
PCIe 320C6317B DSP Octal Serial Controller
- DSP: Based on the Texas Instruments floating-point Digital Signal Processor TMS320C6713B at 300 MHz
- Serial Controllers: Quad 16 MHz SCC85230 serial controllers with 8 serial channels total
- I/O Options: Optional mezzanine-based I/O or RS232C/RS422/RS485 drivers
- PCI Express Interface: PCIe x1 lane, compliant with PCIe Specification r1.0a, offering up to 250 MB/s bandwidth39
- Front Panel I/O: Front panel serial I/O available
- Communication Protocols: Multi-protocol support including synchronous, asynchronous, Bisync, Xon/Xoff, HDLC, or SDLC communication protocols
- Performance: Adds high-speed, low latency I/O and deterministic control to a low-cost PC system solution
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PCIe-6713-ISC8
PCIe 320C6317B DSP Octal Serial Controller
The board features private SDRAM and Flash memory attached to a DSP, with an FPGA providing timing and control. Peripherals include a serial port and connectors for IP mezzanine boards, allowing for flexible expansion and integration of additional functionalities. The Flash memory is utilized for downloading programs into non-volatile memory, ensuring persistent storage of configurations and applications. A PCIe 1x lane bus connector serves as the interface to the host computer, facilitating communication and data transfer between the board and the host system. The PCIe-6713-ISC8 module is ideal for applications requiring low-cost, high-density I/O or unique combinations. It can be used to simply move data to and from the PCIe bus or to provide multi-protocol support up to the application level. Custom application software can be downloaded to the DSP via the PCIe bus, allowing for flexible and customizable solutions.
DSP Features
- TMS320C6713B DSP @ 300 MHz
- 32/64-bit data word
- Executes up to 8 32-bit instructions per cycle
- Up to 2400 MIPS/MFLOPS
- Advanced VLIW DSP core with 8 independent functional units:
- 2 fixed-point ALUs
- 4 floating/fixed-point ALUs
- 2 floating/fixed-point multipliers
- L1/L2 memory architecture:
- 4K-byte L1P program cache
- 4K-byte L1D data cache (2-way)
- 256K-byte L2 memory with 64K-byte unified cache/mapped RAM and 192K-byte additional mapped RAM
- Load-store architecture with 32 32-bit general-purpose registers
- Native instructions for IEEE 754 single and double precision operations
- 32-bit external memory interface with glueless interface to SRAM, EPROM, Flash, SBSRAM, and SDRAM
- 512 Mbyte total addressable external memory space
- Dual 32-bit general-purpose timers
- 16-channel Enhanced DMA (EDMA)
- Two Inter-Integrated Circuit (I2C) buses
- 16-bit Host-Port Interface (HPI)
- IEEE-1149.1 (JTAG) boundary scan compatible
85230 Features
- 16 MHz clock
- Programmable synchronous and isosynchronous data rates
- Asynchronous capabilities
- 5, 6, 7, or 8 bits per character
- 1, 1.5, or 2 stop bits
- Odd or even parity
- 1x, 16x, 32x, or 64x clock modes
- Direct byte-oriented synchronous support
- Direct SDLC/HDLC support
- Receiver/transmitter FIFO
- DPLL for clock recovery
- Baud rate generator for each channel
- NRZ, NRZI, or FM encoding/decoding with Manchester coding support
PCIe Bus Features
- 3.3V I/O, 5V tolerant bus interfaces
- Local Bus Clock rates at 66MHz
- Compliant with PCIe Specification, r1.0a
- PCIMG 1.x compliant
- Multiple DMA operational modes
- Direct master data transfers
- Direct slave data transfers
- Power consumption: 1.0 Watt
Operating Environment
- Operating temperature:
- Commercial: 0 to +70 °C
- Optional: -25 °C to +80 °C
- Non-operating temperature: -40 °C to +85 °C
- Airflow requirement: 5 CFM
- Humidity: 5 to 90% (non-condensing)
- Altitude: Up to 10,000 feet
Mechanical Environment
- Size: Standard Full-size PCI Express Card
- Power consumption: 1.0 watt
- Vibration resistance: 0.5G, 20-2000 Hz random
- Shock resistance: 20G, 11 ms, ½ sine
- Weight: To be determined
- MTBF: >250,000 hours
Software Drivers
- Linux drivers
- Windows XP drivers
- VxWorks drivers
- C library DLLs
Software Tools
- TI eXpressDSP development tools
- Code Composer Studio (CCS) Integrated Development Environment (IDE)
- JTAG-based emulation for real-time debugging
- DSP/BIOS kernel for real-time operating system support
Part Number: PCIe-6713B-ISC8-1
-
- 3U 320C6713B DSP with 8 serial communication channels
- Part Number: PCIe-6713B-ISC8-2
- 3U 320C6713B DSP with WANTap
- Part Number: PCIe-6713B-ISC8-3
- 3U 320C6713B DSP – 8 x RS 422
- Part Number: PCIe-6713B-ISC8-4
- 3U 320C6713B DSP – 8 x RS 232
Optional Accessories:
- Part Number: CBL-50-HRS
- Cable
- Part Number: TB-50-HRS
- Terminal block
- DSP: Based on the Texas Instruments floating-point Digital Signal Processor TMS320C6713B at 300 MHz
- Serial Controllers: Quad 16 MHz SCC85230 serial controllers with 8 serial channels total
- I/O Options: Optional mezzanine-based I/O or RS232C/RS422/RS485 drivers
- PCI Express Interface: PCIe x1 lane, compliant with PCIe Specification r1.0a, offering up to 250 MB/s bandwidth39
- Front Panel I/O: Front panel serial I/O available
- Communication Protocols: Multi-protocol support including synchronous, asynchronous, Bisync, Xon/Xoff, HDLC, or SDLC communication protocols
- Performance: Adds high-speed, low latency I/O and deterministic control to a low-cost PC system solution
| Mechanical Interface | Switched Mezzanine Card (XMC) Interface confirming to ANSI/VITA 42.0-2008 (Auxiliary Standard) Standard single-width (149mm x 74mm) | |||||||||
| Electrical Interface | PCI Express x4 Link (Base Specification 2.1) compliant interface conforming to ANSI/VITA 42.3-2006 (PCI Express Protocol Layer Standard) | |||||||||
| PCI Express Switch | PI7C9X2G312GP (Pericom) | |||||||||
| PCI Express to PCI Bridge | XIO2001 (Texas Instruments) | |||||||||
| User configurable FPGA | TXMC639-10R: XC7K160T-2FBG676I (AMD) TXMC639-11R: XC7K325T-2FBG676I (AMD) | |||||||||
| SPI-Flash | MT25QL128 (Micron) 128 Mbit (contains TXMC639 FPGA BRD) or compatible; +3.3 V supply voltage | |||||||||
| DDR3 RAM | 2x MT41K256M16TW-107 (Micron) 256Meg x 32 bit | |||||||||
| Board Configuration Controller | LCMXO2-7000HC (Lattice) | |||||||||
| ADC | LTC2320 -16 (Analog Devices) | |||||||||
| DAC | AD5547BRUZ (Analog Devices) | |||||||||
| A/D Channels | TXMC639-10R: 8 Differential 16bit A/D Channels TXMC639-11R: 16 Differential 16bit A/D Channels Input Configuration per BCC Device: Input Voltage Ranges: Differental : ±20.57 V, ±10.28 V or ±5.14 V (Single-Ended: ±10.28 V, ±5.14 V or ±2.57 V) All analog inputs are connected via an impedance converter and a second operation amplifier for level adjustment and filtering to the differential ADC inputs. The -3 dB limit of this input stage is at approx. 8MHz | |||||||||
| D/A Channels | TXMC639-10R: 4 Single-Ended 16 Bit D/A Channels TXMC639-11R: 8 Single-Ended 16 Bit D/A Channels Output range configurable per D/A channel. Maximum single-ended Output Voltage – Vout: ±10 V Maximum Output Drive Current for each Output: 10 mA Maximum Capacitive Load for each Output: 1000 pF Typical Settling Time for a 10 mA / 1000 pF: < 1 µs | |||||||||
| Digital Front I/O Channels | 32 digital I/O Lines
| |||||||||
| Digital Rear I/O Channels | 64 direct FPGA I/O lines to P14 Rear I/O connector
4 MGT line to P16 Rear I/O connector
| |||||||||
| Front I/O | Front I/O Samtec – ERF8_050_01_L_D_RA_L_TR | |||||||||
| P14 Rear I/O | 64 pin Mezzanine Connector (Molex 71436-2864 or compatible) | |||||||||
| P16 Rear I/O | 114 pin Mezzanine Connector (Samtec – ASP-105885-01) | |||||||||
| Power Requirements 1) | Depends on FPGA design With TXMC639 Board Reference Design / without external load
| |||||||||
| Temperature Range | Operating: – 40 °C to + 85 °C Storage: – 55 °C to + 125 °C | |||||||||
| MTBF 1) | 157 000 h to 161 000 h | |||||||||
| Humidity | 5% – 95% non-condensing | |||||||||
| Weight | 140 g |
1) depends on variant, for further details see User Manual
TXMC639-10R
| 8x Analog In, 4x Analog Out, XC7K160T-2FBG676 Kintex™ 7 FPGA AMD Kintex™ 7 FPGA (XC7K160T-2FBG676), 1GB DDR3, 8x Analog In, 4x Analog Out, 32x digital Front I/O, 64x direct FPGA Rear I/O Lines and 4x MGTs Rear I/O |
TXMC639-11R
| 16x Analog In, 8x Analog Out, XC7K325T-2FBG676 Kintex™ 7 FPGA AMD Kintex™ 7 FPGA (XC7K325T-2FBG676), 1GB DDR3, 16x Analog In, 8x Analog Out, 32x digital Front I/O, 64x direct FPGA Rear I/O Lines and 4x MGTs Rear I/O |
SOFTWARE
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