M.2-ETH1G-4

Four Channels Gigabit Ethernet Controller
M.2 30x42mm

  • M.2 30mm x 42mm board size
  • M.2 PCI Express x1 lane interface
  • M.2 3042 Key B & M
  • Intel® I350 controller
  • 9KB jumbo frame support
  • Flow control support
  • PXE support
  • Two channels on-board transformer 10/100/1000Mbps per channel
  • Two channels off-board transformer 10/100/1000Mbps per channel
  • IEEE802.3az Energy Efficient Ethernet power consumption

 

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M.2-ETH1G-4

Four Channels Gigabit Ethernet Controller
M.2 30x42mm

  • M.2 30mm x 42mm board size
  • M.2 PCI Express x1 lane interface
  • M.2 3042 Key B & M
  • Intel® I350 controller
  • 9KB jumbo frame support
  • Flow control support
  • PXE support
  • Two channels on-board transformer 10/100/1000Mbps per channel
  • Two channels off-board transformer 10/100/1000Mbps per channel
  • IEEE802.3az Energy Efficient Ethernet power consumption

 

The M.2-ETH1G-4 employs the Intel I350 Ethernet Controller for 10/100/1000Mbps communications on up to four concurrent channels. Its compact M.2 form factor allows it to be used in numerous applications such as industrial PCs, single board computers and embedded systems.

Power Saving Features

  • ACPI power management states and wake-up capability
  • Advanced Power Management (APM) wake-up functionality
  • Low power link-disconnect state
  • DMA Coalescing for improved system power management
  • Energy Efficient Ethernet (IEEE802.3az) for reduced power consumption during low link utilization periods

 

Performance Enhancements

  • PCIe v 2.1 TLP Process Hints (TPH)
  • UDP, TCP and IP Checksum offload
  • UDP and TCP Transmit Segmentation Offload (TSO)
  • SCTP receive and transmit checksum offload

 

Virtualization Features

  • Support of up to 8 Virtual Machines per port
  • 8 TX and 8 RX queues per port
  • PCI-SIG I/O SR-IOV support (direct assignment)

 

Timing and Synchronization

  • IEEE 1588 Precision Time Protocol support
  • Per-packet timestamp

 

Applications

This is a solution for a wide array of Ethernet communication applications such as:

  • Commercial networks
  • Industrial and Military
  • Test equipment supporting evaluation, simulation
  • Monitoring and analysis

 

Available Software Drivers

  • Linux® drivers
  • Windows® drivers
  • VxWorks® drivers

 

Mechanical

  • Size: M.2 Module Key B & M (30mm x 42mm)
  • Power: 5W max
  • Front panel I/O
  • Vibration: 0.5G, 20-2000Hz rand
  • Shock: 20G, 11ms, ½ sine
  • Weight: 10g (0.4oz)
  • MTBF: >250,000 hours

 

Operating Environment

  • Operating temperature
    • Industrial: -10ºC to +55ºC
  • Non-operating: -50ºC to +90ºC
  • Airflow requirement: .5CFM
  • Humidity: 5 to 90% (non-cond)
  • Altitude: 0 to 10,000 feet

 

Ordering Information

  • M.2-ETH1G-4-I Four Channels Gigabit Ethernet Controller, Industrial Temp -10ºC to +55ºC
  • Append -CC for Conformal Coat

 

Optional Accessories

  • TB-M.2-ETH1G-4 Terminal Block to Quad RJ-45, 12in length

 

Data Sheet – Link Here

  • M.2 30mm x 42mm board size
  • M.2 PCI Express x1 lane interface
  • M.2 3042 Key B & M
  • Intel® I350 controller
  • 9KB jumbo frame support
  • Flow control support
  • PXE support
  • Two channels on-board transformer 10/100/1000Mbps per channel
  • Two channels off-board transformer 10/100/1000Mbps per channel
  • IEEE802.3az Energy Efficient Ethernet power consumption
 

 

Mechanical Interface

Switched Mezzanine Card (XMC) Interface confirming to ANSI/VITA 42.0-2008 (Auxiliary Standard)

Standard single-width (149mm x 74mm)

Electrical InterfacePCI Express x4 Link (Base Specification 2.1) compliant interface conforming to ANSI/VITA 42.3-2006 (PCI Express Protocol Layer Standard)
PCI Express SwitchPI7C9X2G312GP (Pericom)
PCI Express to PCI BridgeXIO2001 (Texas Instruments)
User configurable FPGA

TXMC639-10R: XC7K160T-2FBG676I (AMD)

TXMC639-11R: XC7K325T-2FBG676I (AMD)

SPI-FlashMT25QL128 (Micron) 128 Mbit (contains TXMC639 FPGA BRD) or compatible; +3.3 V supply voltage
DDR3 RAM2x MT41K256M16TW-107 (Micron) 256Meg x 32 bit
Board Configuration ControllerLCMXO2-7000HC (Lattice)
ADCLTC2320 -16 (Analog Devices)
DACAD5547BRUZ (Analog Devices)
A/D Channels

TXMC639-10R: 8 Differential 16bit A/D Channels

TXMC639-11R: 16 Differential 16bit A/D Channels

Input Configuration per BCC Device:

Input Voltage Ranges:

Differental : ±20.57 V, ±10.28 V or ±5.14 V

(Single-Ended: ±10.28 V, ±5.14 V or ±2.57 V)

All analog inputs are connected via an impedance converter and a second operation amplifier for level adjustment and filtering to the differential ADC inputs.

The -3 dB limit of this input stage is at approx. 8MHz

D/A Channels

TXMC639-10R: 4 Single-Ended 16 Bit D/A Channels

TXMC639-11R: 8 Single-Ended 16 Bit D/A Channels

Output range configurable per D/A channel.
Simultaneous Conversion for all D/A Channels.

Maximum single-ended Output Voltage – Vout: ±10 V

Maximum Output Drive Current for each Output: 10 mA

Maximum Capacitive Load for each Output: 1000 pF

Typical Settling Time for a 10 mA / 1000 pF: < 1 µs

Digital Front I/O Channels

32 digital I/O Lines

  • Default configured as 32 ESD-protected TTL lines
  • 16 I/O lines are configurable as 8 differential RS422 I/O lines with individual Termination enable.
Digital Rear I/O Channels

64 direct FPGA I/O lines to P14 Rear I/O connector

  • Can be used as single-ended or differential I/O
  • FPGA I/O Standard: LVCMOS25, LVTTL25 and LVDS25

4 MGT line to P16 Rear I/O connector

  • Each line consists of one differential RX and TX pair.
  • Transmission speeds of up to 3.125 Gb/s are possible.
Front I/OFront I/O Samtec – ERF8_050_01_L_D_RA_L_TR
P14 Rear I/O64 pin Mezzanine Connector (Molex 71436-2864 or compatible)
P16 Rear I/O114 pin Mezzanine Connector (Samtec – ASP-105885-01)
Power Requirements 1)

Depends on FPGA design

With TXMC639 Board Reference Design / without external load

 typical @ +12 V VPWRtypical @ +5 V VPWR
TXMC639-10R1.1 A2.5 A
TXMC639-11R1.3 A3.3 A
Temperature RangeOperating: – 40 °C to + 85 °C
Storage: – 55 °C to + 125 °C
MTBF 1)157 000 h to 161 000 h
Humidity5% – 95% non-condensing
Weight140 g

1) depends on variant, for further details see User Manual

 

TXMC639-10R

 

8x Analog In, 4x Analog Out, XC7K160T-2FBG676 Kintex™ 7 FPGA

AMD Kintex™ 7 FPGA (XC7K160T-2FBG676), 1GB DDR3, 8x Analog In, 4x Analog Out, 32x digital Front I/O, 64x direct FPGA Rear I/O Lines and 4x MGTs Rear I/O

TXMC639-11R

 

16x Analog In, 8x Analog Out, XC7K325T-2FBG676 Kintex™ 7 FPGA

AMD Kintex™ 7 FPGA (XC7K325T-2FBG676), 1GB DDR3, 16x Analog In, 8x Analog Out, 32x digital Front I/O, 64x direct FPGA Rear I/O Lines and 4x MGTs Rear I/O

SOFTWARE

Device Driver for Board Family with Reconfigurable FPGA

Data Sheet – Link-Here

User Manual – Link-Here

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