Eth-ReporterII

Rugged, Small, Lightweight, Ethernet, FPGA-Based Multi-Function I/O Controller

  • User FPGA for applications requirements via RS-232/422/488 (encryption, custom communication protocols, etc.)
  • One GigE port with ModBus TCP
  • Up to three RS-232/422/485 ports via User FPGA
  • Thirty six general purpose LVTTL lines with 1KΩ pull up resistor
  • Twelve buffered general purpose LVTTL lines with 24mA drive per line
  • Four low-side open drain output channels with 1A drive per channel
  • Eight RS-422 output channels, twelve input channels

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Eth-ReporterII

Rugged, Small, Lightweight, Ethernet, FPGA-Based Multi-Function I/O Controller

  • User FPGA for applications requirements via RS-232/422/488 (encryption, custom communication protocols, etc.)
  • One GigE port with ModBus TCP
  • Up to three RS-232/422/485 ports via User FPGA
  • Thirty six general purpose LVTTL lines with 1KΩ pull up resistor
  • Twelve buffered general purpose LVTTL lines with 24mA drive per line
  • Four low-side open drain output channels with 1A drive per channel
  • Eight RS-422 output channels, twelve input channels

The Eth-ReporterII is an Ethernet-based Multi-Function I/O module that employs dual Altera Cyclone FPGAs for maximum deterministic performance and I/O capability. The module provides an Ethernet network interface for Digital I/O, Analog, and Serial communication. Although it is fully functional as delivered, the User FPGA can be modified for custom bus implementations, allowing maximum flexibility and pre-processing capability for time-sensitive applications. To communicate with the host, the ATC-ETH-DIG-I/O uses the simple standard networking protocol Modbus, which allows for control and data transfers.

The Eth-ReporterII uses a single 160 pin I/O connector for all system inputs and outputs. The I/O connector is a high density D-type connector with female pins. The mating cable end connector is available in a number of configurations to meet specific application requirements.

All Features:

  • User FPGA for applications requirements via RS-232/422/488 (encryption, custom communication protocols, etc.)
  • One GigE port with ModBus TCP
  • Up to three RS-232/422/485 ports via User FPGA
  • Thirty six general purpose LVTTL lines with 1KΩ pull up resistor
  • Twelve buffered general purpose LVTTL lines with 24mA drive per line
  • Four low-side open drain output channels with 1A drive per channel
  • Eight RS-422 output channels, twelve input channels
  • One I2C interface channel
  • One SPI interface channel
  • Eight 16-bit A/D channels for external voltage monitor
  • Internal voltage monitor capability
  • Designed and manufactured in USA

Environment:

  • Operating temperature: -40° to +85° C
  • Shock: 30G, 15ms sawtooth
  • Vibration: 15G, 5-2000 Hz
  • Input voltage: +12 to +28 VDC

Mechanical:

  • Size: 5.4″ x 5.5″ x 1.6″ (WDH)
  • Rear panel I/O: 160-pin Molex
  • Weight: 1.67 lbs
  • MTBF: >250,000 hours

Data Sheet – Link Here

User Manual – Link Here

  • User FPGA for applications requirements via RS-232/422/488 (encryption, custom communication protocols, etc.)
  • One GigE port with ModBus TCP
  • Up to three RS-232/422/485 ports via User FPGA
  • Thirty six general purpose LVTTL lines with 1KΩ pull up resistor
  • Twelve buffered general purpose LVTTL lines with 24mA drive per line
  • Four low-side open drain output channels with 1A drive per channel
  • Eight RS-422 output channels, twelve input channels

 

Mechanical Interface

Switched Mezzanine Card (XMC) Interface confirming to ANSI/VITA 42.0-2008 (Auxiliary Standard)

Standard single-width (149mm x 74mm)

Electrical InterfacePCI Express x4 Link (Base Specification 2.1) compliant interface conforming to ANSI/VITA 42.3-2006 (PCI Express Protocol Layer Standard)
PCI Express SwitchPI7C9X2G312GP (Pericom)
PCI Express to PCI BridgeXIO2001 (Texas Instruments)
User configurable FPGA

TXMC639-10R: XC7K160T-2FBG676I (AMD)

TXMC639-11R: XC7K325T-2FBG676I (AMD)

SPI-FlashMT25QL128 (Micron) 128 Mbit (contains TXMC639 FPGA BRD) or compatible; +3.3 V supply voltage
DDR3 RAM2x MT41K256M16TW-107 (Micron) 256Meg x 32 bit
Board Configuration ControllerLCMXO2-7000HC (Lattice)
ADCLTC2320 -16 (Analog Devices)
DACAD5547BRUZ (Analog Devices)
A/D Channels

TXMC639-10R: 8 Differential 16bit A/D Channels

TXMC639-11R: 16 Differential 16bit A/D Channels

Input Configuration per BCC Device:

Input Voltage Ranges:

Differental : ±20.57 V, ±10.28 V or ±5.14 V

(Single-Ended: ±10.28 V, ±5.14 V or ±2.57 V)

All analog inputs are connected via an impedance converter and a second operation amplifier for level adjustment and filtering to the differential ADC inputs.

The -3 dB limit of this input stage is at approx. 8MHz

D/A Channels

TXMC639-10R: 4 Single-Ended 16 Bit D/A Channels

TXMC639-11R: 8 Single-Ended 16 Bit D/A Channels

Output range configurable per D/A channel.
Simultaneous Conversion for all D/A Channels.

Maximum single-ended Output Voltage – Vout: ±10 V

Maximum Output Drive Current for each Output: 10 mA

Maximum Capacitive Load for each Output: 1000 pF

Typical Settling Time for a 10 mA / 1000 pF: < 1 µs

Digital Front I/O Channels

32 digital I/O Lines

  • Default configured as 32 ESD-protected TTL lines
  • 16 I/O lines are configurable as 8 differential RS422 I/O lines with individual Termination enable.
Digital Rear I/O Channels

64 direct FPGA I/O lines to P14 Rear I/O connector

  • Can be used as single-ended or differential I/O
  • FPGA I/O Standard: LVCMOS25, LVTTL25 and LVDS25

4 MGT line to P16 Rear I/O connector

  • Each line consists of one differential RX and TX pair.
  • Transmission speeds of up to 3.125 Gb/s are possible.
Front I/OFront I/O Samtec – ERF8_050_01_L_D_RA_L_TR
P14 Rear I/O64 pin Mezzanine Connector (Molex 71436-2864 or compatible)
P16 Rear I/O114 pin Mezzanine Connector (Samtec – ASP-105885-01)
Power Requirements 1)

Depends on FPGA design

With TXMC639 Board Reference Design / without external load

 typical @ +12 V VPWRtypical @ +5 V VPWR
TXMC639-10R1.1 A2.5 A
TXMC639-11R1.3 A3.3 A
Temperature RangeOperating: – 40 °C to + 85 °C
Storage: – 55 °C to + 125 °C
MTBF 1)157 000 h to 161 000 h
Humidity5% – 95% non-condensing
Weight140 g

1) depends on variant, for further details see User Manual

 

TXMC639-10R

 

8x Analog In, 4x Analog Out, XC7K160T-2FBG676 Kintex™ 7 FPGA

AMD Kintex™ 7 FPGA (XC7K160T-2FBG676), 1GB DDR3, 8x Analog In, 4x Analog Out, 32x digital Front I/O, 64x direct FPGA Rear I/O Lines and 4x MGTs Rear I/O

TXMC639-11R

 

16x Analog In, 8x Analog Out, XC7K325T-2FBG676 Kintex™ 7 FPGA

AMD Kintex™ 7 FPGA (XC7K325T-2FBG676), 1GB DDR3, 16x Analog In, 8x Analog Out, 32x digital Front I/O, 64x direct FPGA Rear I/O Lines and 4x MGTs Rear I/O

SOFTWARE

Device Driver for Board Family with Reconfigurable FPGA

Data Sheet – Link-Here

User Manual – Link-Here

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