M.2-1553-2

Two Channels Dual Redundant 1553 Controller, Multiple RT Support

  • M.2 PCI Express x1 lane interface
  • M.2 3042 Key B & M
  • Two dual redundant MIL-STD-1553 Total-AceXtreme® controllers (A/B channel)
  • Multiprotocol support: MIL-STD-1553A/B STANAG-3838 and MIL-STD-1760
  • 2MB RAM per Channel
  • Programmable mode: Bus Controller, Remote Terminal with concurrent bus monitor
  • IRIG-106 Chapter 10 monitor
  • Emulate up to 31 RT addresses simultaneously
  • Filter based on RT address, T/R bit, sub-address
  • Transformer coupled

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M.2-1553-2

Two Channels Dual Redundant 1553 Controller, Multiple RT Support

  • M.2 PCI Express x1 lane interface
  • M.2 3042 Key B & M
  • Two dual redundant MIL-STD-1553 Total-AceXtreme® controllers (A/B channel)
  • Multiprotocol support: MIL-STD-1553A/B STANAG-3838 and MIL-STD-1760
  • 2MB RAM per Channel
  • Programmable mode: Bus Controller, Remote Terminal with concurrent bus monitor
  • IRIG-106 Chapter 10 monitor
  • Emulate up to 31 RT addresses simultaneously
  • Filter based on RT address, T/R bit, sub-address
  • Transformer coupled

The M.2-1553-2 uses the DDC Total-AceXtreme communication device as its 1553 bus controller or remote terminal with concurrent bus monitor. The dual controller has a dual redundant channel with built-in transceivers and transformer. The controller has the capability to emulate up to 31 RT addresses simultaneously. The M.2-1553-2 in RT mode can filter on RT address, T/R, Subaddress. The M.2-1553-2 is offered in extended temperature. The board format is an M.2 30mm x 42mm.

  • 1553 Capabilities
    • Dual redundant MIL-STD-1553
    • BC or Multi-RT with Concurrent Bus Monitor
    • Supports MIL-STD-1553 A/B and MIL-STD-1760
    • 2 MB (64K x 36) RAM
    • 48-bit/100ns Time Stamp
    • IRIG-106 Chapter 10 MT Support
  • 1553 Bus Monitor (MT)
    • IRIG-106 Chapter 10 compatibility
    • Filter based on RT Address, T/R bit, Sub-Address
    • Advanced bit-level error detection to isolate bus failures
    • DMA engine for ultra-low CPU utilization
  • 1553 Bus Remote Terminal (RT)
    • Emulates up to 32 RT addresses simultaneously
    • Multiple buffering techniques
    • Programmable command illegalization
    • Programmable busy by sub-address
  • 1553 Bus Controller (BC)
    • Streaming and minor/major frame scheduling of messages
    • High- and low-priority asynchronous message insertion
    • Modify messages or data while BC is running
  • Applications
    • Industrial and Military
    • Test equipment supporting evaluation, simulation
    • Monitoring and analysis
  • Available Software Drivers
    • Linux® drivers
    • Windows® drivers
    • VxWorks® drivers
  • Mechanical
    • Size: M.2 Module Key B & M (30mm x 42mm)
    • Power: 240mA
    • Front panel I/O
    • Vibration: 0.5G, 20-2000Hz rand
    • Shock: 20G, 11ms, ½ sine
    • Weight: 10g (0.4oz)
    • MTBF: >250,000 hours
  • Operating Environment
    • Operating temperature
      • Commercial: 0 to +70ºC
      • Industrial: -40ºC to +85ºC
    • Non-operating: -50ºC to +90ºC
    • Airflow requirement: .5CFM
    • Humidity: 5 to 90% (non-cond)
    • Altitude: 0 to 10,000 feet

M.2-1553-2
Two Channels Dual Redundant Controllers, Industrial Temp -40ºC to +85ºC

M.2-1553-1
One Channel Dual Redundant Controller, Industrial Temp -40ºC to +85ºC
Append -CC for Conformal Coat

Optional Accessories
CBL-M.2-1553-12 1 x Micro Connector to twin axial cable, 12in length

Data Sheet – Link Here

User Manual – Link Here

  • M.2 PCI Express x1 lane interface
  • M.2 3042 Key B & M
  • Two dual redundant MIL-STD-1553 Total-AceXtreme® controllers (A/B channel)
  • Multiprotocol support: MIL-STD-1553A/B STANAG-3838 and MIL-STD-1760
  • 2MB RAM per Channel
  • Programmable mode: Bus Controller, Remote Terminal with concurrent bus monitor
  • IRIG-106 Chapter 10 monitor
  • Emulate up to 31 RT addresses simultaneously
  • Filter based on RT address, T/R bit, sub-address
  • Transformer coupled

 

Mechanical Interface

Switched Mezzanine Card (XMC) Interface confirming to ANSI/VITA 42.0-2008 (Auxiliary Standard)

Standard single-width (149mm x 74mm)

Electrical InterfacePCI Express x4 Link (Base Specification 2.1) compliant interface conforming to ANSI/VITA 42.3-2006 (PCI Express Protocol Layer Standard)
PCI Express SwitchPI7C9X2G312GP (Pericom)
PCI Express to PCI BridgeXIO2001 (Texas Instruments)
User configurable FPGA

TXMC639-10R: XC7K160T-2FBG676I (AMD)

TXMC639-11R: XC7K325T-2FBG676I (AMD)

SPI-FlashMT25QL128 (Micron) 128 Mbit (contains TXMC639 FPGA BRD) or compatible; +3.3 V supply voltage
DDR3 RAM2x MT41K256M16TW-107 (Micron) 256Meg x 32 bit
Board Configuration ControllerLCMXO2-7000HC (Lattice)
ADCLTC2320 -16 (Analog Devices)
DACAD5547BRUZ (Analog Devices)
A/D Channels

TXMC639-10R: 8 Differential 16bit A/D Channels

TXMC639-11R: 16 Differential 16bit A/D Channels

Input Configuration per BCC Device:

Input Voltage Ranges:

Differental : ±20.57 V, ±10.28 V or ±5.14 V

(Single-Ended: ±10.28 V, ±5.14 V or ±2.57 V)

All analog inputs are connected via an impedance converter and a second operation amplifier for level adjustment and filtering to the differential ADC inputs.

The -3 dB limit of this input stage is at approx. 8MHz

D/A Channels

TXMC639-10R: 4 Single-Ended 16 Bit D/A Channels

TXMC639-11R: 8 Single-Ended 16 Bit D/A Channels

Output range configurable per D/A channel.
Simultaneous Conversion for all D/A Channels.

Maximum single-ended Output Voltage – Vout: ±10 V

Maximum Output Drive Current for each Output: 10 mA

Maximum Capacitive Load for each Output: 1000 pF

Typical Settling Time for a 10 mA / 1000 pF: < 1 µs

Digital Front I/O Channels

32 digital I/O Lines

  • Default configured as 32 ESD-protected TTL lines
  • 16 I/O lines are configurable as 8 differential RS422 I/O lines with individual Termination enable.
Digital Rear I/O Channels

64 direct FPGA I/O lines to P14 Rear I/O connector

  • Can be used as single-ended or differential I/O
  • FPGA I/O Standard: LVCMOS25, LVTTL25 and LVDS25

4 MGT line to P16 Rear I/O connector

  • Each line consists of one differential RX and TX pair.
  • Transmission speeds of up to 3.125 Gb/s are possible.
Front I/OFront I/O Samtec – ERF8_050_01_L_D_RA_L_TR
P14 Rear I/O64 pin Mezzanine Connector (Molex 71436-2864 or compatible)
P16 Rear I/O114 pin Mezzanine Connector (Samtec – ASP-105885-01)
Power Requirements 1)

Depends on FPGA design

With TXMC639 Board Reference Design / without external load

 typical @ +12 V VPWRtypical @ +5 V VPWR
TXMC639-10R1.1 A2.5 A
TXMC639-11R1.3 A3.3 A
Temperature RangeOperating: – 40 °C to + 85 °C
Storage: – 55 °C to + 125 °C
MTBF 1)157 000 h to 161 000 h
Humidity5% – 95% non-condensing
Weight140 g

1) depends on variant, for further details see User Manual

 

TXMC639-10R

 

8x Analog In, 4x Analog Out, XC7K160T-2FBG676 Kintex™ 7 FPGA

AMD Kintex™ 7 FPGA (XC7K160T-2FBG676), 1GB DDR3, 8x Analog In, 4x Analog Out, 32x digital Front I/O, 64x direct FPGA Rear I/O Lines and 4x MGTs Rear I/O

TXMC639-11R

 

16x Analog In, 8x Analog Out, XC7K325T-2FBG676 Kintex™ 7 FPGA

AMD Kintex™ 7 FPGA (XC7K325T-2FBG676), 1GB DDR3, 16x Analog In, 8x Analog Out, 32x digital Front I/O, 64x direct FPGA Rear I/O Lines and 4x MGTs Rear I/O

SOFTWARE

Device Driver for Board Family with Reconfigurable FPGA

Data Sheet – Link-Here

User Manual – Link-Here

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