- Settling Time: 2 µS
- Multiplying DAC Type: 4-Quadrant Multiplying DAC
- Output Ranges:
- Unipolar: 0V to 10V
- Bipolar Mode: ±10V
- Linearity: 1LSB Max DNL and INL over the industrial temperature range
- Glitch Impulse: < 2nV-s
- Power-On Reset: Resets to 0V
- Output Buffers:
- Differential Output buffers with current drive of 5mA
- Voltage Reference: Selectable Internal/External Vref with differential input per channel
- Global Output Buffer: Features internal or external triggering
IP-FASTDAC
Ultra Precise 2 µSecond 4-Quandrant Multiplying DACs 8 channels 16 bit Differential Outputs
- Settling Time: 2 µS
- Multiplying DAC Type: 4-Quadrant Multiplying DAC
- Output Ranges:
- Unipolar: 0V to 10V
- Bipolar Mode: ±10V
- Linearity: 1LSB Max DNL and INL over the industrial temperature range
- Glitch Impulse: < 2nV-s
- Power-On Reset: Resets to 0V
- Output Buffers:
- Differential Output buffers with current drive of 5mA
- Voltage Reference: Selectable Internal/External Vref with differential input per channel
- Global Output Buffer: Features internal or external triggering
Share this product
The IP-FastDAC-x is a ultra precise 16 bit D/A Industry Pack module. There are eight 4-quadrant multiplying DAC channels using the Linear Tech LTC1821 digital to analog chip. The settling time for each DAC is 2 microSeconds. The IP-FastDAC-x offers a differential Output voltage ranges Unipolar: 0V to 10V and Bipolar +/-10V
The IP-FastDAC-8D offers the flexibility of selecting the on board reference or using and external Differential input Vreference input per channel.
The DACs are accurate to 1LSB over the industrial temperature range in both uni-polar and bi-polar modes. These devices include an internal deglitcher circuit that reduces the glitch impulse to less than 2nV-s (typ).
Applications
- Process Control and Industrial Automation
- Precision Instrumentation
- Direct Digital Waveform Generation
- Software-Controlled Gain Adjustment
- Automatic Test Equipment
Programmable via
- IP Bus
IP interface
- 8/32 MHz clock
- 16 bit data
Operating: Environmental
- Operating temperature
- Commercial: 0 to +55 °C
- Optional: -25°C to +80°C
- Non-operating: -40°C to 85 °C
- Airflow requirement: 0.5 CFM
- Humidity: 5 to 90% (non-condensing)
- Altitude: 0 to 10,000 ft
Mechanical: Environmental
- Size: Vita 4 Type 1 IP 1.8″ x 3.9″
- Power: +5, +12, -12 volts
- Vibration: 0.5G RMS 20-2000 Hz rand
- Shock: 20 G, 11 ms, 1⁄2 sine
- Weight: tbd
- MTBF: >250,000 hours
ORDERING INFORMATION
- Part Number: IP-FastDAC-4 – 4 Channel 4 Quadrant DAC Industry Pack Module
- IP-FastDAC or IP-FastDAC-8 – 8 Channel 4 Quadrant DAC Industry Pack Module
- IP-FastDAC-x-I – Same as above with -40°C to +85°C temperature range
Optional Accessories:
-
- Part Number: TB-50-HDR – A combination of a terminal block and a flat ribbon cable, both are for a standard connection setup.
- Settling Time: 2 µS
- Multiplying DAC Type: 4-Quadrant Multiplying DAC
- Output Ranges:
- Unipolar: 0V to 10V
- Bipolar Mode: ±10V
- Linearity: 1LSB Max DNL and INL over the industrial temperature range
- Glitch Impulse: < 2nV-s
- Power-On Reset: Resets to 0V
- Output Buffers:
- Differential Output buffers with current drive of 5mA
- Voltage Reference: Selectable Internal/External Vref with differential input per channel
- Global Output Buffer: Features internal or external triggering
Mechanical Interface | Switched Mezzanine Card (XMC) Interface confirming to ANSI/VITA 42.0-2008 (Auxiliary Standard) Standard single-width (149mm x 74mm) | |||||||||
Electrical Interface | PCI Express x4 Link (Base Specification 2.1) compliant interface conforming to ANSI/VITA 42.3-2006 (PCI Express Protocol Layer Standard) | |||||||||
PCI Express Switch | PI7C9X2G312GP (Pericom) | |||||||||
PCI Express to PCI Bridge | XIO2001 (Texas Instruments) | |||||||||
User configurable FPGA | TXMC639-10R: XC7K160T-2FBG676I (AMD) TXMC639-11R: XC7K325T-2FBG676I (AMD) | |||||||||
SPI-Flash | MT25QL128 (Micron) 128 Mbit (contains TXMC639 FPGA BRD) or compatible; +3.3 V supply voltage | |||||||||
DDR3 RAM | 2x MT41K256M16TW-107 (Micron) 256Meg x 32 bit | |||||||||
Board Configuration Controller | LCMXO2-7000HC (Lattice) | |||||||||
ADC | LTC2320 -16 (Analog Devices) | |||||||||
DAC | AD5547BRUZ (Analog Devices) | |||||||||
A/D Channels | TXMC639-10R: 8 Differential 16bit A/D Channels TXMC639-11R: 16 Differential 16bit A/D Channels Input Configuration per BCC Device: Input Voltage Ranges: Differental : ±20.57 V, ±10.28 V or ±5.14 V (Single-Ended: ±10.28 V, ±5.14 V or ±2.57 V) All analog inputs are connected via an impedance converter and a second operation amplifier for level adjustment and filtering to the differential ADC inputs. The -3 dB limit of this input stage is at approx. 8MHz | |||||||||
D/A Channels | TXMC639-10R: 4 Single-Ended 16 Bit D/A Channels TXMC639-11R: 8 Single-Ended 16 Bit D/A Channels Output range configurable per D/A channel. Maximum single-ended Output Voltage – Vout: ±10 V Maximum Output Drive Current for each Output: 10 mA Maximum Capacitive Load for each Output: 1000 pF Typical Settling Time for a 10 mA / 1000 pF: < 1 µs | |||||||||
Digital Front I/O Channels | 32 digital I/O Lines
| |||||||||
Digital Rear I/O Channels | 64 direct FPGA I/O lines to P14 Rear I/O connector
4 MGT line to P16 Rear I/O connector
| |||||||||
Front I/O | Front I/O Samtec – ERF8_050_01_L_D_RA_L_TR | |||||||||
P14 Rear I/O | 64 pin Mezzanine Connector (Molex 71436-2864 or compatible) | |||||||||
P16 Rear I/O | 114 pin Mezzanine Connector (Samtec – ASP-105885-01) | |||||||||
Power Requirements 1) | Depends on FPGA design With TXMC639 Board Reference Design / without external load
| |||||||||
Temperature Range | Operating: – 40 °C to + 85 °C Storage: – 55 °C to + 125 °C | |||||||||
MTBF 1) | 157 000 h to 161 000 h | |||||||||
Humidity | 5% – 95% non-condensing | |||||||||
Weight | 140 g |
1) depends on variant, for further details see User Manual
TXMC639-10R
| 8x Analog In, 4x Analog Out, XC7K160T-2FBG676 Kintex™ 7 FPGA AMD Kintex™ 7 FPGA (XC7K160T-2FBG676), 1GB DDR3, 8x Analog In, 4x Analog Out, 32x digital Front I/O, 64x direct FPGA Rear I/O Lines and 4x MGTs Rear I/O |
TXMC639-11R
| 16x Analog In, 8x Analog Out, XC7K325T-2FBG676 Kintex™ 7 FPGA AMD Kintex™ 7 FPGA (XC7K325T-2FBG676), 1GB DDR3, 16x Analog In, 8x Analog Out, 32x digital Front I/O, 64x direct FPGA Rear I/O Lines and 4x MGTs Rear I/O |