- PCIe Bus Interface via PLX 9056
- High Performance Floating-Point DSP
- Up to 64MHz system clock.
- 512K bytes of zero wait state SRAM
- 4.0 Mbit flash memory for bootstrap program
- 4 Mbytes of Dual Ported SRAM
PCIe-4PACK-64
INTELLIGENT PCIEPRESS QUAD INDUSTRY PACK CARRIER TMS 320C31 DSP
- PCIe Bus Interface via PLX 9056
- High Performance Floating-Point DSP
- Up to 64MHz system clock.
- 512K bytes of zero wait state SRAM
- 4.0 Mbit flash memory for bootstrap program
- 4 Mbytes of Dual Ported SRAM
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PCIe-4PACK-64
INTELLIGENT PCIEPRESS QUAD INDUSTRY PACK CARRIER TMS 320C31 DSP
The PCIe-4PACK-64 module provides a high performance flexible I/O scheme, that supports industry standard Industry Packs. For application requiring low cost, high density I/O or unique combinations, the PCIe 4PACK is the ideal solution. The local C31 DSP can be used to simply move data to and from the PCI bus or provide pre processing functions such as local PID controls, FFT’s, digital filtering, etc. Custom application software can be downloaded to the DSP via the PCI bus. A very low cost, non-intelligent version is also available, PCI-SIP. The PCIe-4PACK-64 is a high performance and flexible DSP + I/O board for servo control and data acquisition. Real-time control in low cost PCI based systems. The design is based around the Texas Instruments floating point Digital Signal Processor TMS-320C31. Supported by 4 Industry Pack site for I/O. There is an unlimited customization of the input output: servo controls, military SONAR – RADAR, aerospace communication systems, test systems, adaptive control, vibration, semiconductor testing. The C31 DSP is supported by TI eXpress-DSP™ set of industry development tools, including a highly optimizing C/C++ Compiler, Code Composer Studio™ JTAG based emulation, real-time debugging, and the DSP/BIOS™ kernel. Available Drivers : – Labview / Matlab – Linux – Window XP
- PVC Interface:
- PCI Bus Target revision 2.2 Signaling Compliant
- VIO 3.3/5.0 Volts
- 32 Bit, 33 MHz
- Interrupts:
- DMA
- Applications:
- Process Control and Industrial Automation
- Precision Instrumentation
- Direct Digital Waveform Generation
- Operating: Environmental
- Operating temperature: Commercial: 0 to +70 °C
- Optional: -40°C to +85°C
- Airflow requirement: .5 CFM
- Humidity: 5 to 90% (non-cond.)
- Altitude: 0 to 30,000 ft
- Mechanical: Environmental
- Size: Single wide PMC 2.92″ x 5.87″
- Power: 1.5 watt
- Front panel I/O
- Vibration: 0.5G RMS 20-2000 Hz rand
- Shock: 20 G, 11 ms, ½ sine
- Weight: tbd
- MTBF: >250000 hours
Ordering Information:
-
- PCIe-4PACK-64 x1 PCIexpress Quad Industry Pack carrier With TMS 320C31 and Interface Board
- 4pack-Mez C31 Serial Interface Board
- CBL-50-HRS 50 pin cable, HRS
Data Sheet – Link Here
- PCIe Bus Interface via PLX 9056
- High Performance Floating-Point DSP
- Up to 64MHz system clock.
- 512K bytes of zero wait state SRAM
- 4.0 Mbit flash memory for bootstrap program
- 4 Mbytes of Dual Ported SRAM
| Mechanical Interface | Switched Mezzanine Card (XMC) Interface confirming to ANSI/VITA 42.0-2008 (Auxiliary Standard) Standard single-width (149mm x 74mm) | |||||||||
| Electrical Interface | PCI Express x4 Link (Base Specification 2.1) compliant interface conforming to ANSI/VITA 42.3-2006 (PCI Express Protocol Layer Standard) | |||||||||
| PCI Express Switch | PI7C9X2G312GP (Pericom) | |||||||||
| PCI Express to PCI Bridge | XIO2001 (Texas Instruments) | |||||||||
| User configurable FPGA | TXMC639-10R: XC7K160T-2FBG676I (AMD) TXMC639-11R: XC7K325T-2FBG676I (AMD) | |||||||||
| SPI-Flash | MT25QL128 (Micron) 128 Mbit (contains TXMC639 FPGA BRD) or compatible; +3.3 V supply voltage | |||||||||
| DDR3 RAM | 2x MT41K256M16TW-107 (Micron) 256Meg x 32 bit | |||||||||
| Board Configuration Controller | LCMXO2-7000HC (Lattice) | |||||||||
| ADC | LTC2320 -16 (Analog Devices) | |||||||||
| DAC | AD5547BRUZ (Analog Devices) | |||||||||
| A/D Channels | TXMC639-10R: 8 Differential 16bit A/D Channels TXMC639-11R: 16 Differential 16bit A/D Channels Input Configuration per BCC Device: Input Voltage Ranges: Differental : ±20.57 V, ±10.28 V or ±5.14 V (Single-Ended: ±10.28 V, ±5.14 V or ±2.57 V) All analog inputs are connected via an impedance converter and a second operation amplifier for level adjustment and filtering to the differential ADC inputs. The -3 dB limit of this input stage is at approx. 8MHz | |||||||||
| D/A Channels | TXMC639-10R: 4 Single-Ended 16 Bit D/A Channels TXMC639-11R: 8 Single-Ended 16 Bit D/A Channels Output range configurable per D/A channel. Maximum single-ended Output Voltage – Vout: ±10 V Maximum Output Drive Current for each Output: 10 mA Maximum Capacitive Load for each Output: 1000 pF Typical Settling Time for a 10 mA / 1000 pF: < 1 µs | |||||||||
| Digital Front I/O Channels | 32 digital I/O Lines
| |||||||||
| Digital Rear I/O Channels | 64 direct FPGA I/O lines to P14 Rear I/O connector
4 MGT line to P16 Rear I/O connector
| |||||||||
| Front I/O | Front I/O Samtec – ERF8_050_01_L_D_RA_L_TR | |||||||||
| P14 Rear I/O | 64 pin Mezzanine Connector (Molex 71436-2864 or compatible) | |||||||||
| P16 Rear I/O | 114 pin Mezzanine Connector (Samtec – ASP-105885-01) | |||||||||
| Power Requirements 1) | Depends on FPGA design With TXMC639 Board Reference Design / without external load
| |||||||||
| Temperature Range | Operating: – 40 °C to + 85 °C Storage: – 55 °C to + 125 °C | |||||||||
| MTBF 1) | 157 000 h to 161 000 h | |||||||||
| Humidity | 5% – 95% non-condensing | |||||||||
| Weight | 140 g |
1) depends on variant, for further details see User Manual
TXMC639-10R
| 8x Analog In, 4x Analog Out, XC7K160T-2FBG676 Kintex™ 7 FPGA AMD Kintex™ 7 FPGA (XC7K160T-2FBG676), 1GB DDR3, 8x Analog In, 4x Analog Out, 32x digital Front I/O, 64x direct FPGA Rear I/O Lines and 4x MGTs Rear I/O |
TXMC639-11R
| 16x Analog In, 8x Analog Out, XC7K325T-2FBG676 Kintex™ 7 FPGA AMD Kintex™ 7 FPGA (XC7K325T-2FBG676), 1GB DDR3, 16x Analog In, 8x Analog Out, 32x digital Front I/O, 64x direct FPGA Rear I/O Lines and 4x MGTs Rear I/O |
SOFTWARE
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