PCIe-Mini-USB3.0

USB 3.0 Controller

  • Add 2 external USB 3.0 ports to the system
  • Fully compliant with USB 3.0 specification
  • Connection bandwidth up to 5 Gbps
  • Fully compatible with USB 2.0 and 1.1 devices
  • Optionally provides up to 900 mA per USB port
  • Installs easily in any PCIe-Mini slot
  • Fully compatible with PCI Express 2.0 and Intel xHCI rev 0.96 specifications
  • Supports Control, Bulk, Interrupt, and Isochronous USB transfer modes

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PCIe-Mini-USB3.0

USB 3.0 Controller

  • Add 2 external USB 3.0 ports to the system
  • Fully compliant with USB 3.0 specification
  • Connection bandwidth up to 5 Gbps
  • Fully compatible with USB 2.0 and 1.1 devices
  • Optionally provides up to 900 mA per USB port
  • Installs easily in any PCIe-Mini slot
  • Fully compatible with PCI Express 2.0 and Intel xHCI rev 0.96 specifications
  • Supports Control, Bulk, Interrupt, and Isochronous USB transfer modes

The PCIe-Mini-USB3.0 board is engineered around the uPD720200A hub controller from RENESAS. The uPD720200 is a 2-Port Universal Serial Bus 3.0 hub controller, which complies with Universal Serial Bus 3.0 Specification and is 100% compatible with Renesas industry standard host controllers. The controller provides four downstream USB ports. Each of these ports supports is fully backwards compatible with all previous versions of USB, LS(low-Speed)/FS (full-Speed/ HS (high-Speed)/ SS (Super-Speed) operation.

Applications:

This board is optimally suited for:

  • Avionics equipment
  • Avionic data communication systems
  • Medical systems
  • Industrial controls
  • Others
  • USB Storage Device, Network Attached Storage (NAS)

Mechanical: Environmental:

  • Size – Mini PCIe Module (30 mm x 50.95 mm)
  • Power – T.B.D.
  • Front panel I/O
  • Vibration – 0.5G, 20-2000 Hz random
  • Shock – 20G, 11 msec, ½ sine
  • Weight – T.B.D.
  • MTBF – >250,000 hours

Operating Environment:

  • Operating temperature (Industrial): -40 ºC to +85 ºC
  • Non-operating: -60 ºC to +120 ºC
  • Humidity – 5 to 90% (non-condensing)
  • Altitude – 0 to 10,000 feet

Software Support:

  • Windows
  • Linux

Ordering Information:

  • Part number: PCIe-Mini–USB3.0
    USB 3.0 interface on Mini PCIe
    Industrial Temp: -40 to +85 C

Data Sheet – Link Here

  • Add 2 external USB 3.0 ports to the system
  • Fully compliant with USB 3.0 specification
  • Connection bandwidth up to 5 Gbps
  • Fully compatible with USB 2.0 and 1.1 devices
  • Optionally provides up to 900 mA per USB port
  • Installs easily in any PCIe-Mini slot
  • Fully compatible with PCI Express 2.0 and Intel xHCI rev 0.96 specifications
  • Supports Control, Bulk, Interrupt, and Isochronous USB transfer modes

 

Mechanical Interface

Switched Mezzanine Card (XMC) Interface confirming to ANSI/VITA 42.0-2008 (Auxiliary Standard)

Standard single-width (149mm x 74mm)

Electrical InterfacePCI Express x4 Link (Base Specification 2.1) compliant interface conforming to ANSI/VITA 42.3-2006 (PCI Express Protocol Layer Standard)
PCI Express SwitchPI7C9X2G312GP (Pericom)
PCI Express to PCI BridgeXIO2001 (Texas Instruments)
User configurable FPGA

TXMC639-10R: XC7K160T-2FBG676I (AMD)

TXMC639-11R: XC7K325T-2FBG676I (AMD)

SPI-FlashMT25QL128 (Micron) 128 Mbit (contains TXMC639 FPGA BRD) or compatible; +3.3 V supply voltage
DDR3 RAM2x MT41K256M16TW-107 (Micron) 256Meg x 32 bit
Board Configuration ControllerLCMXO2-7000HC (Lattice)
ADCLTC2320 -16 (Analog Devices)
DACAD5547BRUZ (Analog Devices)
A/D Channels

TXMC639-10R: 8 Differential 16bit A/D Channels

TXMC639-11R: 16 Differential 16bit A/D Channels

Input Configuration per BCC Device:

Input Voltage Ranges:

Differental : ±20.57 V, ±10.28 V or ±5.14 V

(Single-Ended: ±10.28 V, ±5.14 V or ±2.57 V)

All analog inputs are connected via an impedance converter and a second operation amplifier for level adjustment and filtering to the differential ADC inputs.

The -3 dB limit of this input stage is at approx. 8MHz

D/A Channels

TXMC639-10R: 4 Single-Ended 16 Bit D/A Channels

TXMC639-11R: 8 Single-Ended 16 Bit D/A Channels

Output range configurable per D/A channel.
Simultaneous Conversion for all D/A Channels.

Maximum single-ended Output Voltage – Vout: ±10 V

Maximum Output Drive Current for each Output: 10 mA

Maximum Capacitive Load for each Output: 1000 pF

Typical Settling Time for a 10 mA / 1000 pF: < 1 µs

Digital Front I/O Channels

32 digital I/O Lines

  • Default configured as 32 ESD-protected TTL lines
  • 16 I/O lines are configurable as 8 differential RS422 I/O lines with individual Termination enable.
Digital Rear I/O Channels

64 direct FPGA I/O lines to P14 Rear I/O connector

  • Can be used as single-ended or differential I/O
  • FPGA I/O Standard: LVCMOS25, LVTTL25 and LVDS25

4 MGT line to P16 Rear I/O connector

  • Each line consists of one differential RX and TX pair.
  • Transmission speeds of up to 3.125 Gb/s are possible.
Front I/OFront I/O Samtec – ERF8_050_01_L_D_RA_L_TR
P14 Rear I/O64 pin Mezzanine Connector (Molex 71436-2864 or compatible)
P16 Rear I/O114 pin Mezzanine Connector (Samtec – ASP-105885-01)
Power Requirements 1)

Depends on FPGA design

With TXMC639 Board Reference Design / without external load

 typical @ +12 V VPWRtypical @ +5 V VPWR
TXMC639-10R1.1 A2.5 A
TXMC639-11R1.3 A3.3 A
Temperature RangeOperating: – 40 °C to + 85 °C
Storage: – 55 °C to + 125 °C
MTBF 1)157 000 h to 161 000 h
Humidity5% – 95% non-condensing
Weight140 g

1) depends on variant, for further details see User Manual

 

TXMC639-10R

 

8x Analog In, 4x Analog Out, XC7K160T-2FBG676 Kintex™ 7 FPGA

AMD Kintex™ 7 FPGA (XC7K160T-2FBG676), 1GB DDR3, 8x Analog In, 4x Analog Out, 32x digital Front I/O, 64x direct FPGA Rear I/O Lines and 4x MGTs Rear I/O

TXMC639-11R

 

16x Analog In, 8x Analog Out, XC7K325T-2FBG676 Kintex™ 7 FPGA

AMD Kintex™ 7 FPGA (XC7K325T-2FBG676), 1GB DDR3, 16x Analog In, 8x Analog Out, 32x digital Front I/O, 64x direct FPGA Rear I/O Lines and 4x MGTs Rear I/O

SOFTWARE

Device Driver for Board Family with Reconfigurable FPGA

Data Sheet – Link-Here

User Manual – Link-Here

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