VME-MIL-STD-1553B

VME-MIL-STD-1553B Dual Redundant Controller Bus Controller / Remote Terminal / Bus Monitor

  • MIL-STD-1553 Compliance: Compliant with MIL-STD-1553B
  • Modes: Supports Bus Controller (BC), Remote Terminal (RT), and Bus Monitor (BM) modes
  • Dual Redundancy: Dual redundant 1553B BC/RT/BM modes
  • Connectors: Dual tri-axial front panel connectors
  • Message Processing: Multiple message processing in BC and RT modes

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VME-MIL-STD-1553B

VME-MIL-STD-1553B Dual Redundant Controller Bus Controller / Remote Terminal / Bus Monitor

  • MIL-STD-1553 Compliance: Compliant with MIL-STD-1553B
  • Modes: Supports Bus Controller (BC), Remote Terminal (RT), and Bus Monitor (BM) modes
  • Dual Redundancy: Dual redundant 1553B BC/RT/BM modes
  • Connectors: Dual tri-axial front panel connectors
  • Message Processing: Multiple message processing in BC and RT modes

The VME-1553-x BCRTM Module is a high-performance, 6U module based on the BCRTM 1553 chip, supporting MIL-STD-1553B standards. It offers options for operating temperatures ranging from 0 to +70 degrees Celsius and -40 to +85 degrees Celsius, with the option for conformal coating. The module supports up to four channels of dual-redundant 1553 bus per channel. It includes 128 Kbyte SRAM and operates in BC (Bus Controller), RT (Remote Terminal), and M (Monitor) modes. The module features dual redundant channels (A and B), 78 ohm transformers, and supports both long and short stub configurations. It includes internal and external clock options and separate logic for the VME interface, ensuring low power consumption. LED status indicators are provided, and software libraries are available for ‘C’, Windows, Linux, and VxWorks, with PICMG compliance.

Module Features

  • UTMC BCRTM controller
  • 128Kbytes SRAM
  • On-chip transceivers
  • On-board transformers
  • Long and short stub configurations supported

Memory

  • 128 Kbyte external SRAM

I/O Capabilities

  • Up to four 1553 bus levels
  • TTL (5v) clock

Programmability

  • Programmable via VME Bus

VME Interface

  • A32/A24/A16 address modes with D16/D08 data modes
  • Read, modify, and write cycles supported
  • Interrupts: software-programmable from 1 to 7

Operating Environment

  • Operating temperature: Commercial 0 to +55 °C, Optional -40°C to +85°C
  • Airflow requirement: 0.5 CFM
  • Humidity: 5 to 90% (non-cond.)
  • Altitude: up to 10,000 ft

Mechanical Environment

  • Size: 6U, 233 x 160mm
  • Power consumption: 1.5 watts
  • Front panel I/O
  • Vibration resistance: 0.5G RMS (20-2000 Hz)
  • Shock resistance: 20 G (11 ms, ½ sine)
  • Weight: To be determined
  • MTBF: >250,000 hours
  • Part Number: COM-1553B-X-Y
    • X = 3 for 3U VME
    • Y = C for Commercial (0° C to +70° C), I for Industrial (-40° C to +85° C), M for Military (MIL-STD-810D)

Data Sheet – Link Here

User Manual – Link Here

  • MIL-STD-1553 Compliance: Compliant with MIL-STD-1553B
  • Modes: Supports Bus Controller (BC), Remote Terminal (RT), and Bus Monitor (BM) modes
  • Dual Redundancy: Dual redundant 1553B BC/RT/BM modes
  • Connectors: Dual tri-axial front panel connectors
  • Message Processing: Multiple message processing in BC and RT modes

 

Mechanical Interface

Switched Mezzanine Card (XMC) Interface confirming to ANSI/VITA 42.0-2008 (Auxiliary Standard)

Standard single-width (149mm x 74mm)

Electrical InterfacePCI Express x4 Link (Base Specification 2.1) compliant interface conforming to ANSI/VITA 42.3-2006 (PCI Express Protocol Layer Standard)
PCI Express SwitchPI7C9X2G312GP (Pericom)
PCI Express to PCI BridgeXIO2001 (Texas Instruments)
User configurable FPGA

TXMC639-10R: XC7K160T-2FBG676I (AMD)

TXMC639-11R: XC7K325T-2FBG676I (AMD)

SPI-FlashMT25QL128 (Micron) 128 Mbit (contains TXMC639 FPGA BRD) or compatible; +3.3 V supply voltage
DDR3 RAM2x MT41K256M16TW-107 (Micron) 256Meg x 32 bit
Board Configuration ControllerLCMXO2-7000HC (Lattice)
ADCLTC2320 -16 (Analog Devices)
DACAD5547BRUZ (Analog Devices)
A/D Channels

TXMC639-10R: 8 Differential 16bit A/D Channels

TXMC639-11R: 16 Differential 16bit A/D Channels

Input Configuration per BCC Device:

Input Voltage Ranges:

Differental : ±20.57 V, ±10.28 V or ±5.14 V

(Single-Ended: ±10.28 V, ±5.14 V or ±2.57 V)

All analog inputs are connected via an impedance converter and a second operation amplifier for level adjustment and filtering to the differential ADC inputs.

The -3 dB limit of this input stage is at approx. 8MHz

D/A Channels

TXMC639-10R: 4 Single-Ended 16 Bit D/A Channels

TXMC639-11R: 8 Single-Ended 16 Bit D/A Channels

Output range configurable per D/A channel.
Simultaneous Conversion for all D/A Channels.

Maximum single-ended Output Voltage – Vout: ±10 V

Maximum Output Drive Current for each Output: 10 mA

Maximum Capacitive Load for each Output: 1000 pF

Typical Settling Time for a 10 mA / 1000 pF: < 1 µs

Digital Front I/O Channels

32 digital I/O Lines

  • Default configured as 32 ESD-protected TTL lines
  • 16 I/O lines are configurable as 8 differential RS422 I/O lines with individual Termination enable.
Digital Rear I/O Channels

64 direct FPGA I/O lines to P14 Rear I/O connector

  • Can be used as single-ended or differential I/O
  • FPGA I/O Standard: LVCMOS25, LVTTL25 and LVDS25

4 MGT line to P16 Rear I/O connector

  • Each line consists of one differential RX and TX pair.
  • Transmission speeds of up to 3.125 Gb/s are possible.
Front I/OFront I/O Samtec – ERF8_050_01_L_D_RA_L_TR
P14 Rear I/O64 pin Mezzanine Connector (Molex 71436-2864 or compatible)
P16 Rear I/O114 pin Mezzanine Connector (Samtec – ASP-105885-01)
Power Requirements 1)

Depends on FPGA design

With TXMC639 Board Reference Design / without external load

 typical @ +12 V VPWRtypical @ +5 V VPWR
TXMC639-10R1.1 A2.5 A
TXMC639-11R1.3 A3.3 A
Temperature RangeOperating: – 40 °C to + 85 °C
Storage: – 55 °C to + 125 °C
MTBF 1)157 000 h to 161 000 h
Humidity5% – 95% non-condensing
Weight140 g

1) depends on variant, for further details see User Manual

 

TXMC639-10R

 

8x Analog In, 4x Analog Out, XC7K160T-2FBG676 Kintex™ 7 FPGA

AMD Kintex™ 7 FPGA (XC7K160T-2FBG676), 1GB DDR3, 8x Analog In, 4x Analog Out, 32x digital Front I/O, 64x direct FPGA Rear I/O Lines and 4x MGTs Rear I/O

TXMC639-11R

 

16x Analog In, 8x Analog Out, XC7K325T-2FBG676 Kintex™ 7 FPGA

AMD Kintex™ 7 FPGA (XC7K325T-2FBG676), 1GB DDR3, 16x Analog In, 8x Analog Out, 32x digital Front I/O, 64x direct FPGA Rear I/O Lines and 4x MGTs Rear I/O

SOFTWARE

Device Driver for Board Family with Reconfigurable FPGA

Data Sheet – Link-Here

User Manual – Link-Here

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