PCIe-Mini-DA4

4 Ch 16-bit D/A Software Programmable 2 µSecond DACs

  • 16-bit D/A converter
  • Settling time: 2 µsec, 0-5V range
  • 500 KSPS throughput
  • Six programmable output ranges per channel
  • Up to 30 mA output drive
  • Requires ±12V external power supply
  • Unipolar: 0V to 5V, 0V to 10V
  • Bipolar Mode: ±5V, ±10V, ±2.5V, –2.5V to 7.5V, ±10 mA continuous, ±30 mA max
  • Multiple output spans available
  • Temperature monitoring function
  • Simultaneous or single update of D/A converter outputs
  • Power-On Reset to 0V
  • Two-stage buffers
  • Global output buffer with internal or external triggering

Share this product

LinkedIn

Got Questions?

PCIe-Mini-DA4

4 Ch 16-bit D/A Software Programmable 2 µSecond DACs

  • 16-bit D/A converter
  • Settling time: 2 µsec, 0-5V range
  • 500 KSPS throughput
  • Six programmable output ranges per channel
  • Up to 30 mA output drive
  • Requires ±12V external power supply
  • Unipolar: 0V to 5V, 0V to 10V
  • Bipolar Mode: ±5V, ±10V, ±2.5V, –2.5V to 7.5V, ±10 mA continuous, ±30 mA max
  • Multiple output spans available
  • Temperature monitoring function
  • Simultaneous or single update of D/A converter outputs
  • Power-On Reset to 0V
  • Two-stage buffers
  • Global output buffer with internal or external triggering

The PCIe-Mini-DA4 is a PCiexpress Mini board with a total of 4 voltage outputs D/A. Each output is followed by a buffer able to provide +/30 mA. Special function code allows global updates of all channels or by a group of eight channels at a time. Standard ping-pong output registers for each channel or optional data RAM allows waveform generation with minimum processor involvement.

An internal register sets the sampling rate of the internal sampling rate generator. The card operates in one of 3 modes:

  • State machine providing automatic update and load on sampling clock.
  • Manual load with update on sampling clock
  • Manual load and update

Application:

This is a perfect solution for:

  • Process control
  • Industrial control
  • Precision instrumentation
  • Data acquisition systems (DAS)
  • Multiaxis positioning systems

D/A Device Specifications:

  • 16-bit, monotonic D/A converter
  • Maximum 16-Bit INL Error: ±1 LSB over temperature
  • 4 output channels per D/A A/D
  • 2 μs settling time to ±1 LSB
  • Low glitch impulse: 1 nV•s
  • Program or pin-strap six output ranges
  • Unipolar: 0V to 5V, 0V to 10V
  • Bipolar: ±5V, ±10V, ±2.5V, –2.5V to 7.5V
  • Power-On Reset to 0V

Mechanical: Environmental:

  • Size: Mini PCIe Module (30 mm x 50.95 mm)
  • Power: T.B.D.
  • Front panel I/O
  • Vibration: 0.5G, 20-2000 Hz random
  • Shock: 20G, 11 msec, ½ sine
  • Weight: T.B.D.
  • MTBF: >250,000 hours

Operating Environment:

  • Operating temperature: -40 ºC to +85 ºC
  • Airflow requirement: 5 CFM
  • Humidity: 5 to 90% (non-condensing)
  • Altitude: 0 to 10,000 feet

Ordering Information:

  • Part number: PCIe-Mini-DA4
    • 4 Channels 16 Bits DA, Ext Temp: -40 ºC to +85 ºC

Data Sheet – Link Here

  • 16-bit D/A converter
  • Settling time: 2 µsec, 0-5V range
  • 500 KSPS throughput
  • Six programmable output ranges per channel
  • Up to 30 mA output drive
  • Requires ±12V external power supply
  • Unipolar: 0V to 5V, 0V to 10V
  • Bipolar Mode: ±5V, ±10V, ±2.5V, –2.5V to 7.5V, ±10 mA continuous, ±30 mA max
  • Multiple output spans available
  • Temperature monitoring function
  • Simultaneous or single update of D/A converter outputs
  • Power-On Reset to 0V
  • Two-stage buffers
  • Global output buffer with internal or external triggering

 

Mechanical Interface

Switched Mezzanine Card (XMC) Interface confirming to ANSI/VITA 42.0-2008 (Auxiliary Standard)

Standard single-width (149mm x 74mm)

Electrical InterfacePCI Express x4 Link (Base Specification 2.1) compliant interface conforming to ANSI/VITA 42.3-2006 (PCI Express Protocol Layer Standard)
PCI Express SwitchPI7C9X2G312GP (Pericom)
PCI Express to PCI BridgeXIO2001 (Texas Instruments)
User configurable FPGA

TXMC639-10R: XC7K160T-2FBG676I (AMD)

TXMC639-11R: XC7K325T-2FBG676I (AMD)

SPI-FlashMT25QL128 (Micron) 128 Mbit (contains TXMC639 FPGA BRD) or compatible; +3.3 V supply voltage
DDR3 RAM2x MT41K256M16TW-107 (Micron) 256Meg x 32 bit
Board Configuration ControllerLCMXO2-7000HC (Lattice)
ADCLTC2320 -16 (Analog Devices)
DACAD5547BRUZ (Analog Devices)
A/D Channels

TXMC639-10R: 8 Differential 16bit A/D Channels

TXMC639-11R: 16 Differential 16bit A/D Channels

Input Configuration per BCC Device:

Input Voltage Ranges:

Differental : ±20.57 V, ±10.28 V or ±5.14 V

(Single-Ended: ±10.28 V, ±5.14 V or ±2.57 V)

All analog inputs are connected via an impedance converter and a second operation amplifier for level adjustment and filtering to the differential ADC inputs.

The -3 dB limit of this input stage is at approx. 8MHz

D/A Channels

TXMC639-10R: 4 Single-Ended 16 Bit D/A Channels

TXMC639-11R: 8 Single-Ended 16 Bit D/A Channels

Output range configurable per D/A channel.
Simultaneous Conversion for all D/A Channels.

Maximum single-ended Output Voltage – Vout: ±10 V

Maximum Output Drive Current for each Output: 10 mA

Maximum Capacitive Load for each Output: 1000 pF

Typical Settling Time for a 10 mA / 1000 pF: < 1 µs

Digital Front I/O Channels

32 digital I/O Lines

  • Default configured as 32 ESD-protected TTL lines
  • 16 I/O lines are configurable as 8 differential RS422 I/O lines with individual Termination enable.
Digital Rear I/O Channels

64 direct FPGA I/O lines to P14 Rear I/O connector

  • Can be used as single-ended or differential I/O
  • FPGA I/O Standard: LVCMOS25, LVTTL25 and LVDS25

4 MGT line to P16 Rear I/O connector

  • Each line consists of one differential RX and TX pair.
  • Transmission speeds of up to 3.125 Gb/s are possible.
Front I/OFront I/O Samtec – ERF8_050_01_L_D_RA_L_TR
P14 Rear I/O64 pin Mezzanine Connector (Molex 71436-2864 or compatible)
P16 Rear I/O114 pin Mezzanine Connector (Samtec – ASP-105885-01)
Power Requirements 1)

Depends on FPGA design

With TXMC639 Board Reference Design / without external load

 typical @ +12 V VPWRtypical @ +5 V VPWR
TXMC639-10R1.1 A2.5 A
TXMC639-11R1.3 A3.3 A
Temperature RangeOperating: – 40 °C to + 85 °C
Storage: – 55 °C to + 125 °C
MTBF 1)157 000 h to 161 000 h
Humidity5% – 95% non-condensing
Weight140 g

1) depends on variant, for further details see User Manual

 

TXMC639-10R

 

8x Analog In, 4x Analog Out, XC7K160T-2FBG676 Kintex™ 7 FPGA

AMD Kintex™ 7 FPGA (XC7K160T-2FBG676), 1GB DDR3, 8x Analog In, 4x Analog Out, 32x digital Front I/O, 64x direct FPGA Rear I/O Lines and 4x MGTs Rear I/O

TXMC639-11R

 

16x Analog In, 8x Analog Out, XC7K325T-2FBG676 Kintex™ 7 FPGA

AMD Kintex™ 7 FPGA (XC7K325T-2FBG676), 1GB DDR3, 16x Analog In, 8x Analog Out, 32x digital Front I/O, 64x direct FPGA Rear I/O Lines and 4x MGTs Rear I/O

SOFTWARE

Device Driver for Board Family with Reconfigurable FPGA

Data Sheet – Link-Here

User Manual – Link-Here

Share this product

LinkedIn
Scroll to Top

User Manual Request

Please submit your information & we will send you a link and password to access our product manual. 

Please submit your information & we will send you a link and password to access our product manual. 

Already have a password? Visit manuals page below.

Already have a password?
Visit manuals page below.