- AXM interface board
- 30 Differential Lines
- Direction Controlled by Channel
- RX 120 Ohm Terminators
- 20Mbps Maximum Data Rate
- No Damage or Latchup Up to ±25kV
- High Input Impedance Supports 256 Nodes
- Guaranteed Failsafe Receiver Operation Over the Entire Common Mode Range
- Compatible with TIA/EIA-485-A Specifications
- Fully Compatible with AXM-D02-JTAG
- Front Panel 68 pin SCSI Connector
AXM-DIFF30
AXM FGA INTERFACE 30 DIFFERENTIAL RS-485 Channels w/CONTROL & TERMINATION
- AXM interface board
- 30 Differential Lines
- Direction Controlled by Channel
- RX 120 Ohm Terminators
- 20Mbps Maximum Data Rate
- No Damage or Latchup Up to ±25kV
- High Input Impedance Supports 256 Nodes
- Guaranteed Failsafe Receiver Operation Over the Entire Common Mode Range
- Compatible with TIA/EIA-485-A Specifications
- Fully Compatible with AXM-D02-JTAG
- Front Panel 68 pin SCSI Connector
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The AXM-DIFF30 is a high-performance AXM interface board designed to manage 30 differential signal lines, with channel-specific direction control for enhanced flexibility. It supports 120 Ohm terminators and achieves a maximum data rate of 20 Mbps, ensuring reliable and high-speed signal transmission. The board is engineered to withstand ±25kV protection against damage or latch-up, and its high input impedance supports up to 256 nodes, making it ideal for complex systems. Additionally, a guaranteed failsafe receiver ensures stable operation across the full common-mode range. The AXM-DIFF30 is a drop-in replacement for the AXM-D02-JTAG, offering full compatibility with existing systems. It complies with TIA/EIA-485-A specifications and connects seamlessly via a 68-pin SCSI front panel connector, providing a robust and reliable solution for high-speed differential signaling applications.
Applications:
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- High-speed differential signaling applications
- Complex systems requiring support for up to 256 nodes
- Drop-in replacement for AXM-D02-JTAG
Mechanical & Environmental:
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- AXM interface board
- Front Panel 68-pin SCSI Connector
Operating Environment:
-
- 30 Differential Lines
- Direction Controlled by Channel
- RX 120 Ohm Terminators
- 20 Mbps Maximum Data Rate
- No Damage or Latchup Up to ±25kV
- High Input Impedance Supports 256 Nodes
- Guaranteed Failsafe Receiver Operation Over the Entire Common Mode Range
- Compatible with TIA/EIA-485-A Specifications
Ordering Information:
-
- Part Number: AXM-DIFF30
CBL-SCSI68 AXM 30 differential channels Option (add following the part number) C (Conformal coat)
- Part Number: AXM-DIFF30
Optional Accessories:
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- Part Number: CBL-SCSI68
68 Pins SCSI Cable 1M
- Part Number: CBL-SCSI68
Data Sheet – Link Here
- AXM interface board
- 30 Differential Lines
- Direction Controlled by Channel
- RX 120 Ohm Terminators
- 20Mbps Maximum Data Rate
- No Damage or Latchup Up to ±25kV
- High Input Impedance Supports 256 Nodes
- Guaranteed Failsafe Receiver Operation Over the Entire Common Mode Range
- Compatible with TIA/EIA-485-A Specifications
- Fully Compatible with AXM-D02-JTAG
- Front Panel 68 pin SCSI Connector
Mechanical Interface | Switched Mezzanine Card (XMC) Interface confirming to ANSI/VITA 42.0-2008 (Auxiliary Standard) Standard single-width (149mm x 74mm) | |||||||||
Electrical Interface | PCI Express x4 Link (Base Specification 2.1) compliant interface conforming to ANSI/VITA 42.3-2006 (PCI Express Protocol Layer Standard) | |||||||||
PCI Express Switch | PI7C9X2G312GP (Pericom) | |||||||||
PCI Express to PCI Bridge | XIO2001 (Texas Instruments) | |||||||||
User configurable FPGA | TXMC639-10R: XC7K160T-2FBG676I (AMD) TXMC639-11R: XC7K325T-2FBG676I (AMD) | |||||||||
SPI-Flash | MT25QL128 (Micron) 128 Mbit (contains TXMC639 FPGA BRD) or compatible; +3.3 V supply voltage | |||||||||
DDR3 RAM | 2x MT41K256M16TW-107 (Micron) 256Meg x 32 bit | |||||||||
Board Configuration Controller | LCMXO2-7000HC (Lattice) | |||||||||
ADC | LTC2320 -16 (Analog Devices) | |||||||||
DAC | AD5547BRUZ (Analog Devices) | |||||||||
A/D Channels | TXMC639-10R: 8 Differential 16bit A/D Channels TXMC639-11R: 16 Differential 16bit A/D Channels Input Configuration per BCC Device: Input Voltage Ranges: Differental : ±20.57 V, ±10.28 V or ±5.14 V (Single-Ended: ±10.28 V, ±5.14 V or ±2.57 V) All analog inputs are connected via an impedance converter and a second operation amplifier for level adjustment and filtering to the differential ADC inputs. The -3 dB limit of this input stage is at approx. 8MHz | |||||||||
D/A Channels | TXMC639-10R: 4 Single-Ended 16 Bit D/A Channels TXMC639-11R: 8 Single-Ended 16 Bit D/A Channels Output range configurable per D/A channel. Maximum single-ended Output Voltage – Vout: ±10 V Maximum Output Drive Current for each Output: 10 mA Maximum Capacitive Load for each Output: 1000 pF Typical Settling Time for a 10 mA / 1000 pF: < 1 µs | |||||||||
Digital Front I/O Channels | 32 digital I/O Lines
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Digital Rear I/O Channels | 64 direct FPGA I/O lines to P14 Rear I/O connector
4 MGT line to P16 Rear I/O connector
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Front I/O | Front I/O Samtec – ERF8_050_01_L_D_RA_L_TR | |||||||||
P14 Rear I/O | 64 pin Mezzanine Connector (Molex 71436-2864 or compatible) | |||||||||
P16 Rear I/O | 114 pin Mezzanine Connector (Samtec – ASP-105885-01) | |||||||||
Power Requirements 1) | Depends on FPGA design With TXMC639 Board Reference Design / without external load
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Temperature Range | Operating: – 40 °C to + 85 °C Storage: – 55 °C to + 125 °C | |||||||||
MTBF 1) | 157 000 h to 161 000 h | |||||||||
Humidity | 5% – 95% non-condensing | |||||||||
Weight | 140 g |
1) depends on variant, for further details see User Manual
TXMC639-10R
| 8x Analog In, 4x Analog Out, XC7K160T-2FBG676 Kintex™ 7 FPGA AMD Kintex™ 7 FPGA (XC7K160T-2FBG676), 1GB DDR3, 8x Analog In, 4x Analog Out, 32x digital Front I/O, 64x direct FPGA Rear I/O Lines and 4x MGTs Rear I/O |
TXMC639-11R
| 16x Analog In, 8x Analog Out, XC7K325T-2FBG676 Kintex™ 7 FPGA AMD Kintex™ 7 FPGA (XC7K325T-2FBG676), 1GB DDR3, 16x Analog In, 8x Analog Out, 32x digital Front I/O, 64x direct FPGA Rear I/O Lines and 4x MGTs Rear I/O |