- FMC ANSI/VITA 57.1 10mm Interface
- Single Width 10mm Stacking Height
- Direct connection to FPGA-boards
- 32 Differential Channels RS422/485 Transceiver
- Data Rate: Up to 16Mbps
- ESD Protection: ±15kV (Human Body Model)
- Fail-Safe: Ensures logic-high output for open, shorted, or idle inputs
- Receiver Hysteresis: 100mV (Improved noise immunity)
FMC-32RS-422
(VITA57.1) I/O 32 DIFFERENTIALS RS422/485 INTERFACE
- FMC ANSI/VITA 57.1 10mm Interface
- Single Width 10mm Stacking Height
- Direct connection to FPGA-boards
- 32 Differential Channels RS422/485 Transceiver
- Data Rate: Up to 16Mbps
- ESD Protection: ±15kV (Human Body Model)
- Fail-Safe: Ensures logic-high output for open, shorted, or idle inputs
- Receiver Hysteresis: 100mV (Improved noise immunity)
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The 32-channel FMC interface board connects to an FPGA-based carrier through an FMC (VITA 57.1) connector, providing 32 configurable RS485/RS-422 differential I/O channels. The board supports speeds up to 16 Mbps and operates with an adjustable voltage of 1.2V to 3.6V for FPGA compatibility. A VHDCI-68 connector provides external access to all channels. Additional features include a power-good LED for voltage monitoring and an I²C EEPROM for system configuration.
Applications
This is an ideal solution for:
- Industrial Automation – Long-distance communication for PLCs and motor controllers.
- Test & Measurement – High-speed signaling for lab instruments and data acquisition.
- Aerospace & Defense – Robust communication for avionics and military systems.
Available Software Drivers
- C library DLLs
- Linux® drivers
- Windows® drivers
Mechanical
- Size: FMC Module 69mm x 76.5mm
- Power: tbd
- Front panel I/O
- Vibration: 0.5G, 20-2000Hz rand
- Shock: 20G, 11msec, ½ sine
- Weight: tbd
- MTBF: >250,000 hours
Operating Environment
- Operating temperature: Industrial: -40ºC to +85ºC
- Airflow requirement: 5CFM
- Humidity: 5 to 90% (non-condensing)
- Altitude: 0 to 10,000 feet
Ordering Information
- FMC-RS-422/485:
FMC 32 Ch RS-422/485 Interface
Industrial Temp: 40ºC to +85
Data Sheet – Link Here
- FMC ANSI/VITA 57.1 10mm Interface
- Single Width 10mm Stacking Height
- Direct connection to FPGA-boards
- 32 Differential Channels RS422/485 Transceiver
- Data Rate: Up to 16Mbps
- ESD Protection: ±15kV (Human Body Model)
- Fail-Safe: Ensures logic-high output for open, shorted, or idle inputs
- Receiver Hysteresis: 100mV (Improved noise immunity)
Mechanical Interface | Switched Mezzanine Card (XMC) Interface confirming to ANSI/VITA 42.0-2008 (Auxiliary Standard) Standard single-width (149mm x 74mm) | |||||||||
Electrical Interface | PCI Express x4 Link (Base Specification 2.1) compliant interface conforming to ANSI/VITA 42.3-2006 (PCI Express Protocol Layer Standard) | |||||||||
PCI Express Switch | PI7C9X2G312GP (Pericom) | |||||||||
PCI Express to PCI Bridge | XIO2001 (Texas Instruments) | |||||||||
User configurable FPGA | TXMC639-10R: XC7K160T-2FBG676I (AMD) TXMC639-11R: XC7K325T-2FBG676I (AMD) | |||||||||
SPI-Flash | MT25QL128 (Micron) 128 Mbit (contains TXMC639 FPGA BRD) or compatible; +3.3 V supply voltage | |||||||||
DDR3 RAM | 2x MT41K256M16TW-107 (Micron) 256Meg x 32 bit | |||||||||
Board Configuration Controller | LCMXO2-7000HC (Lattice) | |||||||||
ADC | LTC2320 -16 (Analog Devices) | |||||||||
DAC | AD5547BRUZ (Analog Devices) | |||||||||
A/D Channels | TXMC639-10R: 8 Differential 16bit A/D Channels TXMC639-11R: 16 Differential 16bit A/D Channels Input Configuration per BCC Device: Input Voltage Ranges: Differental : ±20.57 V, ±10.28 V or ±5.14 V (Single-Ended: ±10.28 V, ±5.14 V or ±2.57 V) All analog inputs are connected via an impedance converter and a second operation amplifier for level adjustment and filtering to the differential ADC inputs. The -3 dB limit of this input stage is at approx. 8MHz | |||||||||
D/A Channels | TXMC639-10R: 4 Single-Ended 16 Bit D/A Channels TXMC639-11R: 8 Single-Ended 16 Bit D/A Channels Output range configurable per D/A channel. Maximum single-ended Output Voltage – Vout: ±10 V Maximum Output Drive Current for each Output: 10 mA Maximum Capacitive Load for each Output: 1000 pF Typical Settling Time for a 10 mA / 1000 pF: < 1 µs | |||||||||
Digital Front I/O Channels | 32 digital I/O Lines
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Digital Rear I/O Channels | 64 direct FPGA I/O lines to P14 Rear I/O connector
4 MGT line to P16 Rear I/O connector
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Front I/O | Front I/O Samtec – ERF8_050_01_L_D_RA_L_TR | |||||||||
P14 Rear I/O | 64 pin Mezzanine Connector (Molex 71436-2864 or compatible) | |||||||||
P16 Rear I/O | 114 pin Mezzanine Connector (Samtec – ASP-105885-01) | |||||||||
Power Requirements 1) | Depends on FPGA design With TXMC639 Board Reference Design / without external load
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Temperature Range | Operating: – 40 °C to + 85 °C Storage: – 55 °C to + 125 °C | |||||||||
MTBF 1) | 157 000 h to 161 000 h | |||||||||
Humidity | 5% – 95% non-condensing | |||||||||
Weight | 140 g |
1) depends on variant, for further details see User Manual
TXMC639-10R
| 8x Analog In, 4x Analog Out, XC7K160T-2FBG676 Kintex™ 7 FPGA AMD Kintex™ 7 FPGA (XC7K160T-2FBG676), 1GB DDR3, 8x Analog In, 4x Analog Out, 32x digital Front I/O, 64x direct FPGA Rear I/O Lines and 4x MGTs Rear I/O |
TXMC639-11R
| 16x Analog In, 8x Analog Out, XC7K325T-2FBG676 Kintex™ 7 FPGA AMD Kintex™ 7 FPGA (XC7K325T-2FBG676), 1GB DDR3, 16x Analog In, 8x Analog Out, 32x digital Front I/O, 64x direct FPGA Rear I/O Lines and 4x MGTs Rear I/O |